Semiconductor Package Heat Dissipator Layout for Dense IC Reliability
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Solution Overview
Problem
As integrated circuits (ICs) become more dense, they generate increasing amounts of heat, leading to reliability issues if effective heat dissipation is not achieved.
Innovation Solution
The method involves forming a semiconductor package with a primary heat dissipator attached to the package substrate and the die, and a secondary heat dissipator on the encapsulant surface, which contacts the primary heat dissipator to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If integrated circuits become more dense to increase functionality, then device capability is improved, but heat generation increases causing reliability issues
Solution Approach 1:
The heat dissipation system is segmented into multiple independent components: a primary heat dissipator attached to the die, an encapsulant covering the package, and a secondary heat dissipator on the encapsulant surface. This segmentation allows heat to be dissipated through multiple separate pathways, improving overall heat management effectiveness while maintaining device reliability
Solution Approach 2:
The patent extends heat dissipation from a single-plane approach to a multi-dimensional structure. The primary heat dissipator handles heat at the die level, while the secondary heat dissipator on the encapsulant surface provides additional heat dissipation at the package level, creating a three-dimensional heat management architecture that effectively manages thermal loads from dense ICs
2Device complexity
If a single heat dissipator is used, then device complexity is low, but heat dissipation effectiveness is insufficient
Solution Approach 1:
The heat dissipation function is divided between a primary heat dissipator directly attached to the die and a secondary heat dissipator mounted on the encapsulant surface. Each component handles a portion of the thermal load, creating a distributed heat management system that improves effectiveness without requiring excessive complexity in any single component
Solution Approach 2:
The encapsulant serves as an intermediary element between the primary and secondary heat dissipators. It provides a mounting surface for the secondary heat dissipator while being encased by the primary heat dissipator, facilitating thermal transfer from the die through multiple stages and improving overall heat dissipation effectiveness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly improves heat dissipation from the die, enhancing the reliability of semiconductor packages by effectively managing thermal issues.
Implementation Method 1
a primary heat dissipator attached to the package substrate and a top die surface of the die. The primary heat dissipator includes a planar member disposed over the top die surface and is configured to dissipate heat from the die
Implementation Method 2
A secondary heat dissipator is disposed on the top encapsulant surface. The secondary heat dissipator contacts the top planar member surface of the primary heat dissipator to enhance heat dissipation from the die
Data Source
AI summary
The present disclosure is directed to improving heat dissipation to provide more reliable semiconductor packages. The semiconductor package may be, for example, a lead frame including one or multiple dies attached thereto. The semiconductor package may include only wire bonds or a combination of clip bonds and wire bonds. The package includes at least primary and secondary heat dissipators to improve heat dissipation. In some embodiments, the package includes a tertiary heat dissipator to further improve heat dissipation.