Semiconductor Package Heat Dissipation Structure With Electrical Isolation
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Solution Overview
Problem
The increasing demand for electronic devices to process large amounts of data at high speeds poses significant challenges in design and packaging, particularly in managing the immense power consumption and resulting thermal energy generation.
Innovation Solution
The implementation of a semiconductor package module with a heat dissipating element that is thermally coupled to the semiconductor package, enhancing heat dissipation through various configurations such as microstructures, stacking structures, and additional coatings to improve thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If high-speed data processing is implemented, then computational ability is improved, but power consumption increases and thermal energy generation worsens
Solution Approach 1:
The patent introduces a vertical heat dissipation dimension by stacking heat dissipation elements above the semiconductor package, transitioning from planar to three-dimensional heat management. This allows heat to be dissipated in the vertical direction, enabling higher computational speeds without proportional increases in power consumption density on the package surface.
Solution Approach 2:
The patent employs thermal interface materials and heat dissipation elements as intermediaries between the semiconductor package and the cooling system. These intermediaries efficiently transfer thermal energy from the heat-generating components to the heat dissipation structures, decoupling the computational performance from direct thermal impact on the package.
2Productivity
If high computational ability is achieved, then processing capability is improved, but thermal energy generation increases
Solution Approach 1:
The patent divides the heat dissipation function into multiple segmented heat dissipation elements stacked in layers. Each layer handles a portion of the thermal load, allowing progressive heat management as computational ability increases. This segmentation enables scaling of computational power without proportional temperature increases.
Solution Approach 2:
The patent utilizes composite heat dissipation structures combining different materials with complementary thermal properties. These composite structures optimize thermal conductivity while managing heat generation, enabling high computational ability to be maintained without excessive temperature rise.
3Temperature
If effective heat dissipation is implemented, then thermal control is improved, but device complexity increases
Solution Approach 1:
The heat dissipation elements are designed to perform multiple functions: thermal management, structural support, and electrical isolation. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity while achieving effective thermal control.
Solution Approach 2:
The patent merges the heat dissipation function with existing package structures by integrating heat dissipation elements into the packaging process. This consolidation achieves effective thermal control without proportionally increasing device complexity, as the heat management features are combined with structural and protective functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively improves the thermal control of semiconductor package modules, enhancing their performance and reliability by efficiently dissipating heat generated during operation.
Implementation Method 1
a heat dissipating element disposed on the non-active side of the semiconductor package, wherein the heat dissipating element is thermally coupled to the semiconductor package
Data Source
AI summary
A semiconductor package module includes a package, a conductive layer, and a heat dissipating module. The package includes a semiconductor die. The conductive layer is disposed over the package. The heat dissipating module is disposed over the conductive layer, and the package and the heat dissipating module prop against two opposite sides of the conductive layer, where the heat dissipating module is thermally coupled to and electrically isolated from the package through the conductive layer.