Semiconductor Package Sidewall Cooling With Insulated Heat Layers
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Solution Overview
Problem
The increasing demand for high-performance semiconductor devices has led to larger semiconductor chips and packages, necessitating miniaturization and multi-functionality, while also requiring effective heat management in reduced thickness electronic devices.
Innovation Solution
A semiconductor package design incorporating a substrate, interposer, semiconductor chips, capacitors, insulating layers, and heat conductive layers with different thermal conductivity materials to efficiently manage heat dissipation, where a conductive material with high thermal conductivity is used in contact with the semiconductor chips' side walls and a non-conductive material with high Young's modulus is applied to prevent heat sink peeling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conductive material with high thermal conductivity is used in the first heat conductive layer to improve heat dissipation, then heat release efficiency is improved, but electrical conductivity may cause short circuit risks
Solution Approach 1:
The heat conductive structure is divided into two separate layers: the first heat conductive layer uses conductive material for efficient heat transfer, while the second heat conductive layer uses insulating material to provide electrical isolation. This segmentation allows each layer to perform its specific function without compromise.
Solution Approach 2:
The second heat conductive layer acts as an intermediary between the conductive first layer and the heat sink, providing electrical insulation while maintaining thermal conduction. This mediator layer resolves the conflict between needing electrical isolation and maintaining heat dissipation efficiency.
2Productivity
If the semiconductor package size is increased to accommodate larger chips for high-performance applications, then processing capacity is improved, but the thickness of the package increases
Solution Approach 1:
The heat conductive layers extend in the horizontal dimension to contact the side walls of semiconductor chips, rather than relying solely on vertical thermal paths. This dimensional change allows for effective heat dissipation without increasing package thickness.
3Adaptability or versatility
If multiple semiconductor chips are incorporated into a single package to achieve multi-functionality and high capacity, then functional capacity is improved, but heat management complexity increases
Solution Approach 1:
The two-layer heat conductive structure serves multiple functions simultaneously: the first layer provides primary thermal conduction, the second layer provides electrical insulation, and together they enable heat management for multiple chips. This universal structure simplifies what would otherwise be complex individual management requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively releases heat generated from semiconductor chips and prevents heat sink detachment, ensuring reliable thermal management in compact, high-performance semiconductor packages.
Implementation Method 1
a first heat conductive layer at least partially surrounding side walls of the first semiconductor chip and disposed on the insulating layer, wherein the first heat conductive layer is in contact with the side walls of the first semiconductor chip
Implementation Method 2
a heat sink covering the insulating layer, the first heat conductive layer, and the second heat conductive layer
Implementation Method 3
a heat sink covering the insulating layer, the first heat conductive layer, and the second heat conductive layer
Data Source
AI summary
A semiconductor package includes: a substrate; a first semiconductor chip disposed on the substrate; a capacitor disposed on the substrate and spaced apart from the first semiconductor chip in a first direction; an insulating layer disposed on the substrate and covering the capacitor; a first heat conductive layer at least partially surrounding side walls of the first semiconductor chip and disposed on the insulating layer, wherein the first heat conductive layer is in contact with the side walls of the first semiconductor chip, and wherein the first heat conductive layer includes a first material that is a conductive material; and a second heat conductive layer disposed on the first heat conductive layer, wherein the second heat conductive layer is in contact with the first heat conductive layer, wherein the second heat conductive layer includes a second material that is a non-conductive material.