Semiconductor Package Layout for Symmetric Heat Dissipation
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Solution Overview
Problem
Highly integrated semiconductor packages face challenges in dissipating heat and are prone to asymmetrical heat generation, which can lead to issues such as warpage.
Innovation Solution
A semiconductor package design featuring symmetrically positioned first and second semiconductor chips with heat transfer parts and an upper wiring structure, where the thickness and positioning of components ensure even heat dispersion and reduce asymmetrical heat generation risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor chips are stacked and mounted in one package wiring structure, then integration function is improved, but heat dissipation performance deteriorates
Solution Approach 1:
The package structure is segmented into multiple independent chip modules (first, second, and third semiconductor chips) that can be separately mounted on the wiring structure. This segmentation allows each chip to have its own heat dissipation path through dedicated heat transfer parts, preventing heat accumulation in a single centralized area and improving overall heat dissipation performance while maintaining high integration function.
2Temperature
If heat transfer parts are added to improve heat dissipation, then temperature control is improved, but device complexity increases
Solution Approach 1:
The heat transfer parts are merged with the wiring structure such that the heat transfer parts and wiring structure form an integrated assembly. The wiring structure serves dual functions as both electrical interconnection and mechanical support for heat transfer components. This merging reduces the number of separate components and simplifies the overall device structure while maintaining effective heat dissipation.
3Ease of manufacture
If asymmetric chip arrangement is used to optimize wiring, then ease of manufacture is improved, but asymmetrical heat generation occurs causing warpage
Solution Approach 1:
The patent deliberately introduces asymmetry in the form of a central third semiconductor chip positioned between the first and second chips. This asymmetric arrangement serves to balance the thermal and mechanical loads by placing the third chip at the center, creating a symmetric heat dissipation pattern around the central axis. This prevents asymmetrical heat generation and reduces package warpage while allowing flexible wiring layouts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation performance and prevents asymmetrical heat generation, thereby reducing the risk of package warpage and improving overall package stability.
Implementation Method 1
Heat transfer parts are disposed on each of the first semiconductor chip and the second semiconductor chip
Implementation Method 2
An upper wiring structure is disposed between the heat transfer parts in the first direction
Implementation Method 3
heat dissipation performance is increased
Data Source
AI summary
A semiconductor package includes a first semiconductor chip and a second semiconductor chip spaced apart from each other in a first direction. Heat transfer parts are disposed on each of the first semiconductor chip and the second semiconductor chip in a second direction intersecting the first direction. An upper wiring structure is disposed between the heat transfer parts in the first direction. A third semiconductor chip is disposed on the upper wiring structure in the second direction. The third semiconductor chip is electrically connected to the upper wiring structure. A thickness of the upper wiring structure in the second direction and a thickness of the heat transfer parts in the second direction are identical to each other.