Semiconductor Package Heat-Pathway Pattern Thermal Management
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Solution Overview
Problem
The increasing demand for high-speed and high-capacity semiconductor devices leads to higher power consumption, making thermal management a critical issue for semiconductor packages, as existing technologies fail to effectively dissipate heat, potentially damaging the chips and affecting their reliability.
Innovation Solution
A semiconductor package design that includes a first semiconductor chip with a heat source and a lower heat-transfer pattern, a second chip with a heat-dissipating part connected through a heat-pathway pattern, and a heat-transfer layer, which enhances heat dissipation by using conductive materials and adhesive polymers to improve thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high-speed and high-capacity semiconductor devices are used, then processing speed and capacity are improved, but power consumption increases leading to poor heat dissipation
Solution Approach 1:
The heat dissipation system is segmented into multiple functional layers: heat-transfer patterns on the chip, heat-pathway patterns in the mold layer, and heat-dissipating parts at the top surface. This segmentation allows heat to be systematically conducted from the heat source through multiple stages to the external environment, effectively managing thermal load in high-power devices
Solution Approach 2:
The heat-pathway pattern acts as an intermediary element between the heat-transfer pattern on the chip and the heat-dissipating part at the top surface. This intermediary conductive structure embedded in the mold layer facilitates efficient heat transfer across the package, solving the thermal management problem in high-capacity devices
2Temperature
If heat dissipation structures are added to improve thermal management, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The mold layer serves multiple functions: it provides mechanical support, electrical insulation, and houses the heat-pathway pattern for thermal management. By integrating the heat dissipation function into the existing mold layer rather than adding separate structures, the design achieves effective heat dissipation without proportionally increasing device complexity
Solution Approach 2:
The heat dissipation system is merged with the package structure by embedding heat-pathway patterns directly into the mold layer. This combination allows the mold layer to simultaneously perform its structural role and facilitate thermal conduction, reducing the need for additional separate heat dissipation components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively transfers heat away from the chip, improving the reliability and operation of semiconductor packages by preventing damage during heat dissipation processes and enhancing thermal management, thus addressing the thermal challenges faced by high-power semiconductor devices.
Implementation Method 1
forming a heat-pathway pattern in the opening to be connected to the heat-transfer pattern... a heat-pathway pattern provided through the mold layer and connected to the lower heat-transfer pattern
Implementation Method 2
a heat-dissipating part disposed on the second semiconductor chip and the mold layer and connected to the heat-pathway pattern
Data Source
AI summary
Provided are semiconductor packages and methods of fabricating the same. The method may include mounting a first semiconductor chip including chip and heat-transfer regions and a lower heat-transfer pattern disposed on the heat-transfer region, on a substrate, mounting a second semiconductor chip on the chip region of the first semiconductor chip, forming a mold layer on the substrate to enclose the first and second semiconductor chips, forming an opening in the mold layer to expose at least a portion of the lower heat-transfer pattern, forming a heat-pathway pattern in the opening, and forming a heat-dissipating part on the second semiconductor chip and the mold layer to be connected to the heat-pathway pattern.