Semiconductor Package Heat Radiation Board Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages face challenges in efficiently radiating heat generated from semiconductor chips due to structural limitations in the lead frame and heat diffusion layers, leading to increased thermal resistance and potential reliability issues during temperature changes.
Innovation Solution
A semiconductor package design featuring a lead frame with terminal pads and first terminal leads made of high copper or aluminum content, along with a heat radiation board attached to the lower surfaces of the terminal pads using a conductive or non-conductive adhesive, and second terminal leads electrically connected to the semiconductor chips using a metal clip or conductive adhesive, ensuring efficient heat dissipation without direct contact with the terminal leads.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a conventional DBC board with copper layers and ceramic layer is used for heat radiation, then the structure provides thermal diffusion capability, but the heat radiation effect is limited and thermal resistance increases
Solution Approach 1:
The patent extracts the heat radiation function from the conventional DBC board structure and implements it through a dedicated heat radiation board attached to the terminal pad. This separates the electrical connection function (terminal pad) from the heat radiation function (heat radiation board), allowing each to be optimized independently. The heat radiation board provides a direct thermal pathway to the package housing without relying on the thermal diffusion layers of the DBC board.
Solution Approach 2:
The patent introduces a heat radiation board as an intermediary component between the terminal pad and the package housing. This intermediary provides a dedicated thermal conduction path that bypasses the limited thermal diffusion capability of the conventional DBC board structure. The heat radiation board acts as a thermal bridge that efficiently transfers heat from the semiconductor chip to the package housing.
2Strength
If the lead frame and DBC board are soldered together for structural support, then bonding strength is achieved, but the bonding strength is lowered during high-temperature transformation
Solution Approach 1:
The patent merges the heat radiation board with the terminal pad structure, attaching the heat radiation board directly to the terminal pad. This integration eliminates the need for separate solder joints between the lead frame and DBC board for heat radiation purposes. The terminal pad itself serves as both the electrical connection and the mounting structure for the heat radiation board, reducing the number of thermal and mechanical joints.
Solution Approach 2:
The patent employs a composite structure where the heat radiation board (made of materials with high thermal conductivity such as copper or aluminum) is attached to the terminal pad. This composite approach combines the electrical conductivity of the lead frame with the thermal conductivity of the heat radiation board, creating a structure that excels in both electrical and thermal performance while maintaining bonding strength stability during temperature transformations.
3Temperature
If the power semiconductor support is stressed during temperature transformation, then thermal diffusion occurs, but reliability of the semiconductor chip is lowered
Solution Approach 1:
The patent segments the thermal management function from the mechanical support function. The terminal pad provides mechanical support and electrical connection, while the heat radiation board provides thermal diffusion. This segmentation allows the heat radiation board to handle thermal stresses independently, preventing stress transmission to the semiconductor chip that would occur in a monolithic DBC board structure.
Solution Approach 2:
The patent applies local quality by using different materials with appropriate properties in different locations. The terminal pad uses materials optimized for electrical connection and mechanical strength, while the heat radiation board uses materials with high thermal conductivity. This localized material selection allows each component to perform its specific function optimally without compromising the other, reducing stress on the semiconductor chip during temperature transformations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively radiates heat from the semiconductor chip to the outside of the package housing, minimizing thermal transformation and enhancing the reliability and electrical stability of the semiconductor package by preventing heat buildup and structural stress.
Implementation Method 1
heat radiation board attached to the lower surfaces of the terminal pads... efficiently radiate heat generated from a semiconductor chip
Implementation Method 2
radiate heat generated from a semiconductor chip to the outside of a package housing
Implementation Method 3
metal clip electrically connecting the semiconductor chips to the second terminal leads
Implementation Method 4
semiconductor chip attached to the upper surfaces of the terminal pads by using a conductive first adhesive
Data Source
AI summary
A semiconductor package includes a terminal pad having at least one first terminal lead structurally connected to the terminal pad, a semiconductor chip attached to an upper surface of the terminal pad by using a first adhesive, a heat radiation board attached to a lower surface of the terminal pad by using a second adhesive, and at least one second terminal lead electrically connected to the semiconductor chip. The second terminal lead is spaced apart from the terminal pad and is separated from the radiation board. The package further includes a metal clip electrically connecting the semiconductor chip to the second terminal lead, and a package housing covering parts of the first terminal lead, the second terminal lead, and the terminal pad. The package housing includes an adhesive spread space to expose the lower surface of the terminal pad.