Semiconductor Package Heat Radiation Pattern with End Openings

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Solution Overview

Problem

Semiconductor packages face reliability issues due to stress concentration on connection terminals and input/output lines caused by heat radiation pattern expansion, leading to potential damage and reduced performance.

Innovation Solution

A semiconductor package design featuring a heat radiation pattern with openings corresponding to the end portions of the semiconductor chip, which prevents stress concentration on connection terminals and input/output lines by partially exposing the base film, thereby enhancing reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a continuous heat radiation pattern is used to maximize heat dissipation, then heat radiation efficiency is improved, but stress concentration on connection terminals and input/output lines increases causing reliability degradation

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidconnection terminal reliability

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The heat radiation pattern is segmented into multiple regions with different characteristics. The central region under the semiconductor chip maintains continuous coverage for efficient heat dissipation, while the end regions are provided with openings to prevent stress concentration on connection terminals. This segmentation allows simultaneous optimization of both heat dissipation and reliability.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the heat radiation pattern are given different qualities: the central region has full coverage for maximum heat radiation, while the end regions have openings to reduce stress. This local differentiation allows each region to serve its specific function optimally without compromising the other.

Inventive Principle:

Principle #3Local quality

2Area of stationary object

If the heat radiation pattern covers the entire base film surface to maximize heat dissipation area, then heat radiation efficiency is improved, but stress-induced damage to input/output lines increases

Engineering Contradiction:

Improveheat radiation areaVSAvoidstress-induced damage

Core Design Contradiction:

Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The heat radiation pattern is divided into a central continuous region and end regions with openings. This segmentation maintains large heat radiation area while eliminating stress concentration zones at the ends where connection terminals are located.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The openings at the end regions, which reduce the total heat radiation area, are strategically positioned to convert the harmful stress concentration effect into a beneficial stress-relief feature. The reduced area at ends prevents damage while the central region provides sufficient heat dissipation.

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

3Ease of manufacture

If the heat radiation pattern is made continuous to simplify manufacturing, then manufacturing complexity is reduced, but reliability decreases due to stress concentration

Engineering Contradiction:

Improveheat radiation pattern fabricationVSAvoidpackage reliability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The heat radiation pattern is segmented into continuous and discontinuous regions, which can be fabricated using standard photolithography and deposition processes. The segmentation is achieved through conventional patterning techniques, maintaining ease of manufacture while improving reliability.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively avoids stress concentration on connection terminals and input/output lines, improving the reliability of the semiconductor package by allowing for efficient heat dissipation without damaging the connection sections.

Implementation Method 1

a heat radiation pattern on the second surface of the base film, the heat radiation pattern corresponding to the semiconductor chip

Methodology Applied

Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS11682633B2Semiconductor package

Publication Date: 2023.06.20 SAMSUNG ELECTRONICS CO LTD

AI summary

Disclosed is a semiconductor package including a base film that has a first surface and a second surface opposite to the first surface, a plurality of input/output lines on the first surface of the base film, a semiconductor chip disposed on the first surface of the base film and connected to the input/output lines and including a central portion and end portions on opposite sides of the central portion, and a heat radiation pattern on the second surface of the base film. The heat radiation pattern corresponds to the semiconductor chip and has a plurality of openings that correspond to the end portions of the semiconductor chip and that vertically overlap the end portions of the semiconductor chip.