Semiconductor package and manufacturing method of semiconductor package
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Fan-out semiconductor packages face challenges in reducing thermal resistance due to insufficient heat release from solder balls, especially when high heat is generated, as the thermal conductivity of resin used for underfill is lower than metal, making it difficult to effectively decrease thermal resistance.
Innovation Solution
The semiconductor package incorporates a semiconductor substrate with a pad and insulating layer, a metal layer covering the insulating layer, an interposer substrate with wire connections, and a solder member, including heat release solder balls or a plate-shaped solder member, to enhance heat dissipation. The solder member is jointed to the metal layer and mounting substrate, with options for ceramic insulating layers and copper metal layers for improved thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder balls are used for heat release from semiconductor substrate, then electrical connection is achieved, but thermal resistance is insufficiently reduced when high heat is generated
Solution Approach 1:
The patent combines signal transmission function and heat release function into a single solder ball structure. The solder ball simultaneously transmits electrical signals from the semiconductor substrate to the mounting substrate and conducts heat away from the semiconductor substrate, eliminating the need for separate heat dissipation components and reducing overall thermal resistance.
Solution Approach 2:
The solder ball is designed to perform multiple functions: electrical connection, signal transmission, and heat dissipation. By making the solder ball multi-functional, the patent reduces the number of components needed and improves heat release capability without increasing device complexity.
2Reliability
If resin underfill is used to fill clearance between substrates, then substrate protection is improved, but thermal conductivity is insufficient compared to metal
Solution Approach 1:
The patent changes the material parameter of the underfill from conventional resin to a material with higher thermal conductivity, such as metal-filled epoxy or ceramic-filled polymer. This parameter change maintains the protective function of filling the clearance between substrates while significantly improving heat conduction capability.
Solution Approach 2:
The patent uses composite materials for the underfill, combining resin matrix with high thermal conductivity fillers such as metal particles, ceramic particles, or carbon-based materials. This composite structure provides both the protective sealing function and enhanced thermal conduction path from the semiconductor substrate to the mounting substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces thermal resistance by providing multiple heat release paths, allowing for efficient heat dissipation from the semiconductor substrate to the mounting substrate, thereby reducing temperature rise and enhancing thermal management.
Implementation Method 1
a solder member to be jointed to the metal layer and the mounting substrate... a function of releasing heat of the semiconductor substrate via the solder member is caused
Data Source
AI summary
In a semiconductor package in which a semiconductor substrate is mounted, thermal resistance of the semiconductor substrate is reduced. The semiconductor package includes a semiconductor substrate, an insulating layer, a metal layer, an interposer substrate, a mounting substrate, a signal transmission solder ball, and a solder member. A pad is provided on one surface of the semiconductor substrate. A different surface of the semiconductor substrate is covered with the insulating layer. The metal layer covers the insulating layer. A wire to be connected to the pad is formed on the interposer substrate. The signal transmission solder ball is jointed to the wire and the mounting substrate, and transmits a predetermined electrical signal. The solder member is jointed to the metal layer and the mounting substrate.