Semiconductor Package Blind-Hole Heat Sink Attachment
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Solution Overview
Problem
Existing semiconductor packages face challenges in thermal dissipation without compromising electrical insulation, as typical molding materials are poor thermal insulators despite providing excellent electrical insulation.
Innovation Solution
A semiconductor package design featuring a fastener receptacle with a blind hole in the encapsulant body or die pad, which includes a metal or plastic insert with greater hardness than the surrounding material, allowing for secure fastening to a heat sink while minimizing package footprint and enhancing thermal performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If molding materials are used to form the package encapsulant body, then electrical insulation properties are improved, but thermal dissipation capability deteriorates
Solution Approach 1:
The encapsulant body is segmented by introducing a blind hole that divides the material structure, allowing insertion of a fastener that creates a thermal pathway. This segmentation enables the encapsulant to maintain its electrical insulation function while providing a dedicated thermal conduction channel through the inserted fastener.
Solution Approach 2:
A fastener insert acts as an intermediary element between the encapsulant body and the heat sink. This intermediary component serves dual purposes: mechanically securing the package while providing a thermal conduction pathway, thus resolving the contradiction between electrical insulation and thermal dissipation.
2Strength
If a fastener receptacle with blind hole and insert is implemented, then thermal dissipation and mechanical stability are improved, but device complexity increases
Solution Approach 1:
The fastener receptacle design merges multiple functions into a single integrated structure: the blind hole provides mechanical retention for the fastener, while the inserted fastener simultaneously serves as both a mechanical anchor and a thermal conduction pathway. This merging reduces the need for separate components and simplifies the overall assembly process.
Solution Approach 2:
The fastener insert is designed to perform multiple functions: it provides mechanical retention by engaging with the blind hole, secures the package to the heat sink, and establishes a thermal conduction pathway. This multi-functionality reduces device complexity by eliminating the need for separate retention and thermal management components.
3Area of stationary object
If the blind hole is formed in the encapsulant body or die pad, then package footprint is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The blind hole is formed as a preliminary feature during the encapsulant molding process or die pad fabrication, before final assembly. This preliminary action allows for precise positioning and integration with other package components, reducing the need for post-processing operations and maintaining tight tolerances throughout manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively improves thermal dissipation and mechanical stability while maintaining electrical insulation, allowing for efficient heat transfer and reduced package size.
Implementation Method 1
a fastener inserted in the fastener receptacle, thereby securing the semiconductor package to the heat sink with the die pad thermally coupled to the heat sink
Data Source
AI summary
A semiconductor package includes a lead frame that includes a die pad and a plurality of leads, a semiconductor die mounted on a die attach surface of the die pad, an encapsulant body of electrically insulating material that covers semiconductor die and portions of the lead frame, and a fastener receptacle that includes a blind hole in the encapsulant body or the die pad, wherein a rear surface of the die pad is exposed from a first main face of the encapsulant body.