Semiconductor Package Heat Sink Thermal Management
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Solution Overview
Problem
Semiconductor packages face challenges in efficiently managing heat generated by multiple semiconductor chips, which can lead to reduced performance and reliability due to thermal energy buildup.
Innovation Solution
The semiconductor package design incorporates dummy chips and heat sinks thermally-mounted on the interposer, with a heat conductive layer between the dummy chips and the main semiconductor chip, allowing for efficient heat dissipation away from the stacked semiconductor chips, thereby reducing heat transfer to them.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor chips are stacked vertically to increase performance, then the processing capability and functionality are improved, but the thermal energy buildup increases and heat dissipation becomes more difficult
Solution Approach 1:
The patent divides the heat dissipation function into multiple independent heat sinks (first heat sink and second heat sink) positioned at different locations. Each heat sink independently manages heat from specific chips, segmenting the thermal management system to improve overall heat dissipation efficiency in the stacked configuration
Solution Approach 2:
The patent transitions from planar heat dissipation to three-dimensional thermal management by positioning heat sinks at vertical extremes (top and bottom) of the stacked chip structure. This spatial distribution across multiple dimensions enables heat to be dissipated from different directions, effectively managing thermal energy in the vertical stacking architecture
2Loss of energy
If heat sinks are positioned close to stacked semiconductor chips for efficient heat transfer, then heat dissipation efficiency is improved, but heat may be transferred to adjacent chips instead of being exhausted
Solution Approach 1:
The patent extracts the heat dissipation function from the chip stack interior by positioning heat sinks at the external extremes (top and bottom) of the stack. This separation ensures that heat is pulled outward and exhausted away from the chip assembly rather than being transferred between adjacent chips within the stack
Solution Approach 2:
The patent introduces thermal interface materials as intermediaries between the semiconductor chips and heat sinks. These materials facilitate controlled heat transfer from chips to heat sinks while managing the thermal pathways to prevent unwanted heat transfer to adjacent chips, acting as a mediator in the thermal management system
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively exhausts heat generated by the main semiconductor chip without transferring it to the stacked chips, enhancing the reliability and performance of the semiconductor package by maintaining lower temperatures within the package.
Implementation Method 1
a heat conductive layer disposed between the first dummy chip and the first semiconductor chip, and between the second dummy chip and the first semiconductor chip
Implementation Method 2
a first heat sink thermally-mounted on the first dummy chip and horizontally spaced apart to one side of the stacked second semiconductor chips, a second heat sink thermally mounted on the second dummy chip
Data Source
AI summary
A semiconductor package includes an interposer, a first semiconductor chip attached onto the interposer, second semiconductor chips stacked on the first semiconductor chip, at least two heat sinks mounted on the interposer and spaced apart from the second semiconductor chips, and a molding layer surrounding the second semiconductor chips and the at least two heat sinks.