Semiconductor Package Heat Sink via Interposer Solder Balls
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The increasing size of semiconductor chips and packages poses a challenge for miniaturization and heat management in electronic devices, as existing solutions fail to effectively dissipate heat generated by high-performance semiconductor chips while maintaining package thickness reduction.
Innovation Solution
A semiconductor package design that incorporates a heat sink pattern with high thermal conductivity on the semiconductor chip, connected to an interposer via solder balls, allowing for efficient heat emission from the chip through the interposer and upper package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If semiconductor chip size and package size are increased to accommodate high-performance elements, then processing power and functionality are improved, but heat dissipation becomes more difficult and package thickness increases
Solution Approach 1:
The heat sink is divided into multiple heat sink patterns arranged in an array on the semiconductor chip. Each heat sink pattern has multiple heat radiating fins that segment the heat dissipation surface, increasing the total surface area for heat radiation while maintaining effective heat dissipation from high-power chips
Solution Approach 2:
The heat sink structures extend in the vertical direction (thickness direction) with multiple heat radiating fins, transforming the heat dissipation from a two-dimensional surface problem to a three-dimensional volume problem. This increases the heat radiating surface area without significantly increasing the horizontal footprint of the chip
2Adaptability or versatility
If multiple semiconductor chips are integrated into a single package to achieve high capacity and multi-functionality, then functionality and capacity are improved, but heat management complexity increases
Solution Approach 1:
The interposer serves multiple functions: it provides electrical interconnection between lower and upper semiconductor chips through conductive vias, provides mechanical support and alignment, and acts as a thermal management component by incorporating heat sink patterns that radiate heat from multiple chips. This universal component simplifies the overall heat management system
Solution Approach 2:
The patent combines multiple heat sink patterns from different semiconductor chips into a unified heat dissipation system through the interposer. The heat sink patterns are electrically connected and thermally coupled, creating a merged thermal management system that handles heat from multiple chips simultaneously, reducing the complexity of managing heat from each chip separately
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively manages heat dissipation, enabling the miniaturization of semiconductor packages while maintaining performance, by utilizing a heat sink pattern and interposer connection to efficiently emit heat generated by the semiconductor chip.
Implementation Method 1
placing a heat sink pattern having a high thermal conductivity on a semiconductor chip disposed in a lower semiconductor package, and by connecting a heat sink pattern to an interposer through a solder ball
Data Source
AI summary
A semiconductor package is provided. The semiconductor package includes a first substrate, a first semiconductor chip disposed on the first substrate, a heat sink structure comprising a lower heat sink pattern disposed on the first semiconductor chip, a metal film pattern disposed on the lower heat sink pattern, and an insulating film disposed on side walls of the lower heat sink pattern and side walls of the metal film pattern, an interposer disposed on the heat sink structure, and a solder ball which connects the heat sink structure and the interposer.