Semiconductor Package Heat Slug for Vertical Passive Device Mounting
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Solution Overview
Problem
The existing semiconductor packages face challenges in efficiently integrating passive devices due to the limited space required for mounting, which hinders the enhancement of signal processing capabilities and increases the risk of overheating.
Innovation Solution
A semiconductor package design that separates the ground plane and power supply source, incorporating a heat slug to cover the semiconductor chip and passive devices, and electrically connects the substrate with the passive devices' electrodes, allowing for vertical mounting of passive devices to reduce area usage and improve heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If passive devices are mounted on the substrate in conventional semiconductor packages, then signal processing capabilities are enhanced, but the area required for mounting increases and heat dissipation becomes less efficient
Solution Approach 1:
The patent transitions passive devices from horizontal mounting on the substrate to vertical mounting on the heat slug surface. This dimensional change from 2D planar mounting to 3D vertical stacking reduces the footprint area occupied by passive devices while maintaining their functionality for signal processing applications.
Solution Approach 2:
The heat slug is designed to serve multiple functions simultaneously: it acts as a thermal management component for heat dissipation, provides a mounting surface for passive devices through its top surface, and functions as an electrical ground reference. This multi-functionality eliminates the need for separate ground planes and mounting areas, reducing overall package area.
2Productivity
If passive devices are mounted on the substrate, then signal processing capabilities are enhanced, but heat management efficiency deteriorates
Solution Approach 1:
The heat slug serves as an intermediary thermal management component between the semiconductor chip and the passive devices. It provides a dedicated heat dissipation path through its high thermal conductivity material, while its top surface acts as a thermal platform for mounting passive devices, enabling efficient heat transfer away from the chip without compromising passive device functionality.
Solution Approach 2:
The patent segments the thermal management function from the substrate by introducing a dedicated heat slug component. This segmentation allows the heat slug to specialize in heat dissipation while the substrate focuses on electrical connectivity and signal routing, improving overall thermal management efficiency while maintaining signal processing capabilities.
3Reliability
If ground plane and power supply are integrated on the substrate, then electrical connectivity is achieved, but area occupancy increases
Solution Approach 1:
The heat slug is designed as a multi-functional component that simultaneously serves as the ground reference plane and provides mounting surface for passive devices. By integrating the ground function into the heat slug rather than requiring a separate ground plane on the substrate, the patent reduces area occupancy while maintaining reliable electrical connectivity for ground references.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables more efficient integration of passive devices, reduces area occupancy, and enhances heat management, leading to improved signal processing capabilities and reduced electromagnetic interference.
Implementation Method 1
a heat slug configured to cover the semiconductor chip and the passive device
Data Source
AI summary
Provided is a semiconductor package including a substrate, a semiconductor chip and a passive device disposed on the substrate, and a heat slug configured to cover the semiconductor chip and the passive device. The substrate and a first electrode of the passive device are electrically connected to each other, and the heat slug and a second electrode of the passive device are electrically connected to each other. The semiconductor package may include multiple passive devices in which a vertical height of each passive device is greater than a horizontal width thereof. Also disclosed is an electronic system, which may include a power supply unit, a microprocessor unit, a function unit, and a display controller unit to receive one or more power supply voltages from the power supply unit. At least one of the microprocessor unit, the function unit, or the display controller unit may further include the described semiconductor package.