Semiconductor Package Thermal Management via Heat Slug
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Solution Overview
Problem
Current semiconductor devices face challenges in achieving high integrity and high speed while effectively managing heat dissipation, which is crucial for maintaining performance and reliability in advanced electronic applications.
Innovation Solution
The semiconductor package device design includes a lower and upper package with a heat dissipation part using thermal interface materials (TIM) and a metal heat slug, along with a package connection pattern, to enhance heat dissipation and electrical connectivity between the packages, allowing for improved thermal management and reduced defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation structures are added to manage thermal effects, then thermal management performance is improved, but device complexity increases
Solution Approach 1:
The patent combines multiple heat dissipation mechanisms (conduction through TIM, convection via heat slug, and radiation) into a unified thermal management system. The heat slug integrates both structural support and thermal dissipation functions, merging mechanical and thermal roles into a single component to reduce overall device complexity while maintaining effective heat management.
Solution Approach 2:
The thermal interface material (TIM) acts as an intermediary between the semiconductor chip and the heat slug, facilitating efficient heat transfer while accommodating thermal expansion differences. This mediator component enables effective thermal coupling without direct metal-to-semiconductor contact, managing thermal stresses and improving heat dissipation performance.
2Temperature
If multiple heat dissipation components are used, then thermal management is improved, but manufacturing complexity increases
Solution Approach 1:
The TIM is pre-applied to the heat slug or chip surface before final assembly, ensuring proper thermal interface coverage. This preliminary action prevents misalignment or insufficient contact during assembly, simplifying the manufacturing process while guaranteeing effective thermal coupling between components.
Solution Approach 2:
The patent optimizes the thermal conductivity parameters and geometric dimensions of the heat slug and TIM layer to achieve effective heat dissipation with minimal component thickness. By carefully controlling these parameters, the design achieves superior thermal performance while reducing the number of assembly steps and simplifying manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively enhances heat dissipation, improving the performance and reliability of semiconductor devices by reducing thermal defects and maintaining high integrity and speed, as demonstrated by simulation results showing superior temperature management compared to traditional designs.
Implementation Method 1
a heat dissipation part filling a space between the lower semiconductor chip and the protruding part of the upper substrate
Implementation Method 2
the heat dissipation part may include a thermal interface material (TIM)
Implementation Method 3
a metal heat slug disposed between the first TIM and the second TIM
Data Source
AI summary
Semiconductor package devices and methods of forming the semiconductor package devices are provided. The semiconductor package devices may include a lower package including a lower semiconductor chip on a lower substrate, an upper package including an upper semiconductor chip on an upper substrate. The upper substrate may include a protruding part corresponding to the lower semiconductor chip and a connection part that has a bottom surface lower than a bottom surface of the protruding part and is disposed around the protruding part. The semiconductor package devices may also include a heat dissipation part in a space between the lower semiconductor chip and the protruding part on the upper substrate and a package connection pattern electrically connecting the lower package to the upper package.