Dual-Sided Semiconductor Package With Feedthrough Heat Slugs
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Solution Overview
Problem
Existing semiconductor packages face challenges in efficiently transferring heat to both sides of the device, are difficult to manufacture, and lack cost-effective alternatives to ceramic substrates and bare die, which limits power density and component placement.
Innovation Solution
A semiconductor device design featuring a package with terminals on one side and heat slugs on the other, connected by feedthrough wires, combined with a manufacturing method involving lead frame assembly, down bonding, and copper deposition to enhance thermal performance and reduce PCB temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If traditional semiconductor packages are used, then manufacturing is simpler, but thermal performance is insufficient and heat cannot be efficiently transferred to both sides
Solution Approach 1:
The package is segmented into distinct functional regions: a first surface for electrical terminals and a second opposite surface for heat dissipation. This segmentation allows independent optimization of electrical and thermal pathways, enabling efficient heat transfer to both sides without compromising manufacturing feasibility.
Solution Approach 2:
The patent employs a nested structure where the semiconductor die is mounted on an intermediate substrate, which is then mounted on the final package substrate. Heat slugs are embedded within the package structure, and wire bonds are nested between layers. This nested arrangement enables complex thermal management functionality while maintaining a compact form factor and reasonable manufacturing complexity.
2Temperature
If ceramic substrates and bare die are used, then thermal performance improves, but cost increases
Solution Approach 1:
The patent replaces expensive ceramic substrates with a cost-effective organic substrate that achieves comparable thermal performance through optimized结构设计. The use of standard wire bonding and mounting techniques further reduces manufacturing costs while maintaining effective heat transfer to both sides of the package.
Solution Approach 2:
The package employs composite construction combining organic substrate materials with high-thermal-conductivity heat slugs and metal trace layers. This composite approach achieves ceramic-level thermal performance at lower cost by strategically placing high-performance materials only where thermally critical, rather than using expensive ceramics throughout the entire structure.
3Power
If PCB temperature is high, then power density is limited, but component placement spacing must be increased
Solution Approach 1:
The patent transitions from single-sided heat dissipation to dual-sided heat dissipation, utilizing the third dimension (vertical heat flow through the package) in addition to lateral heat flow. This dimensional change in thermal management enables higher power density by extracting heat from both surfaces of the package, reducing overall temperature and allowing closer component placement on the PCB.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal performance by allowing efficient heat dissipation to both sides of the package, reduces PCB temperature, and offers a cost-effective alternative to ceramic substrates, improving power density and enabling closer component placement.
Implementation Method 1
at least one feedthrough wire in the package such that the feedthrough wire electrically connects with the at least one heat slug
Implementation Method 2
forming an electrical connection through printing of a copper deposition on the exposed parts of the at least one heat slug and the at least one feedthrough wire
Data Source
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AI summary
According to a first example of the disclosure, a semiconductor device is proposed, which consists of a package with a first surface side and a second surface side opposite to the first surface side. The package comprising at least one semiconductor structure and a group of terminals, wherein the group of terminals is connected to the at least one semiconductor structure and mounted and exposed on the first surface side of the package. The package further comprising at least one heat slug mounted and exposed on the second surface side of the package, and at least one feedthrough wire in the package such that the feed through wire electrically connects with the at least one heat slug.