Semiconductor Package Layout With Overlapping Heat Spreader
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Solution Overview
Problem
Semiconductor packages face challenges in thermal management due to increasing power consumption and heat generation, requiring improved thermal radiation solutions to maintain efficiency and reliability.
Innovation Solution
A semiconductor package design incorporating a thermal radiation structure that overlaps and entirely covers the semiconductor chip, utilizing a thermal radiation member with high thermal conductivity, such as copper, to effectively dissipate heat, while maintaining electrical connections and reducing warpage risk through strategically placed connection structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a thermal radiation structure is added to improve heat dissipation, then thermal radiation capability is improved, but device complexity increases
Solution Approach 1:
The thermal radiation structure is merged with the existing package substrate and connection structures. The thermal radiation member is integrated into the package substrate to form a unified structure that serves both as a mounting platform and a heat dissipation pathway, eliminating the need for separate thermal management components.
Solution Approach 2:
The package substrate is designed to serve multiple functions: electrical connection, mechanical support, and thermal radiation. By incorporating the thermal radiation member directly into the substrate, the same structure performs both signal transmission and heat dissipation functions, reducing overall device complexity.
2Temperature
If the thermal radiation structure completely overlaps the semiconductor chip, then heat dissipation efficiency is improved, but warpage risk increases
Solution Approach 1:
The thermal radiation member is positioned to overlap the semiconductor chip in the vertical direction, creating a localized thermal management zone where heat dissipation is most needed. This targeted approach provides effective cooling at the heat source while minimizing the thermal stress distribution across the entire package structure.
Solution Approach 2:
The package employs a composite structure combining the semiconductor chip, package substrate, and thermal radiation member made of materials with different thermal and mechanical properties. This composite design allows the thermal radiation member to conduct heat away from the chip while the overall structure maintains dimensional stability and resists warpage through material property complementarity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances thermal radiation capabilities, ensuring effective heat dissipation and increased operating reliability by completely overlapping the thermal radiation structure with the semiconductor chip, thereby addressing thermal management challenges and reducing warpage risks.
Implementation Method 1
utilizing a thermal radiation member with high thermal conductivity, such as copper, to effectively dissipate heat
Implementation Method 2
a thermal radiation structure that overlaps the logic chip in the vertical direction
Data Source
AI summary
Disclosed is a semiconductor package comprising a lower circuit part having a first region and a second region horizontally offset from each other and including a connection structure within the first region and a logic chip within the second region, a memory structure that overlaps the connection structure in a vertical direction, and a thermal radiation structure that overlaps the logic chip in the vertical direction. The logic chip and the memory structure are spaced apart in a horizontal direction parallel to a top surface of the logic chip.