Semiconductor Package Structure With Warpage Control and Heat Spreading

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Solution Overview

Problem

The semiconductor industry faces challenges in integrating smaller electronic components into compact packages that provide sufficient rigidity and thermal management while minimizing warpage and twisting.

Innovation Solution

A package structure is developed with a redistribution layer (RDL) and protection layer that includes polymer and conductive layers, integrated fan-out vias (TIVs), and a heat spreader to enhance rigidity and thermal conductivity, while using encapsulants and underfill layers for structural integrity and protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If smaller electronic components are integrated into compact packages, then integration density is improved, but package rigidity deteriorates

Engineering Contradiction:

Improveintegration densityVSAvoidpackage rigidity

Core Design Contradiction:

ProductivityVSStrength

Solution Approach 1:

The patent employs a composite package structure combining organic substrate, ceramic substrate, and metal heat spreader layers. This multi-material composite approach provides enhanced rigidity and structural support while maintaining compact dimensions, directly resolving the contradiction between high integration density and sufficient package rigidity.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent transitions from two-dimensional planar integration to three-dimensional stacked architecture with multiple layers (organic substrate layer, ceramic substrate layer, heat spreader layer). This vertical dimensionality enables higher integration density while each layer contributes to overall structural rigidity through their stacked configuration.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If package size is reduced, then compactness is improved, but thermal management capability deteriorates

Engineering Contradiction:

Improvepackage sizeVSAvoidthermal management

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The patent incorporates a metal heat spreader layer within the compact multi-layer structure. This high-thermal-conductivity material embedded in the composite package enables efficient heat dissipation from high-density integrated components, maintaining thermal management capability despite reduced overall package volume.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent implements vertical heat dissipation pathways through the stacked layers, with the heat spreader layer positioned to collect and distribute heat in the third dimension. This three-dimensional thermal management architecture achieves effective heat dissipation within a compact footprint.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Productivity

If integration density is increased, then productivity is improved, but warpage and twisting increase

Engineering Contradiction:

Improveintegration densityVSAvoidwarpage and twisting

Core Design Contradiction:

ProductivityVSStability of the object's composition

Solution Approach 1:

The patent uses a composite multi-layer structure with organic substrate, ceramic substrate, and metal heat spreader layers. This composite architecture provides balanced thermal and mechanical properties that compensate for stress differentials, reducing warpage and twisting while enabling high integration density.

Inventive Principle:

Principle #40Composite materials

Solution Approach 2:

The patent applies different materials with specific local properties to different layers: organic substrate for flexibility, ceramic substrate for thermal stability, and metal heat spreader for thermal conduction. This localized material optimization stabilizes the overall structure against warpage and twisting.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides a compact, rigid, and thermally efficient package structure that minimizes warpage and twisting, enabling efficient integration and connection to other package components.

Implementation Method 1

a heat spreader to enhance rigidity and thermal conductivity

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

using encapsulants and underfill layers for structural integrity and protection

Methodology Applied

Scientific EffectElasticity: Elasticity

Data Source

PatentUS12506008B2Package structure

Publication Date: 2025.12.23 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

Provided is a package structure including a die, a through via, an encapsulant, a warpage controlling layer, and a cap. The through via is laterally aside the die. The encapsulant laterally encapsulates the through via and the die. The warpage controlling layer covers the encapsulant and the die. The cap is laterally aside the warpage controlling layer and on the through via. The cap has a top surface higher than a top surface of the encapsulant and lower than a top surface of the warpage controlling layer.