Power Semiconductor Package Heat Storage for Short-Time Thermal Surges
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Solution Overview
Problem
Conventional power semiconductor devices face challenges in effectively dissipating high heat generated by electronic components, particularly during short-time high-power operations, leading to overheating and reduced reliability.
Innovation Solution
Incorporating a heat storage portion with higher specific heat capacity into the circuit board, either on or embedded within, to quickly store and release heat generated by electronic components, enhancing heat dissipation and reducing temperature spikes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of power semiconductor device is reduced and internal component density is increased, then miniaturization and high density are achieved, but heat dissipation capability deteriorates
Solution Approach 1:
The heat dissipation system is segmented into multiple independent heat dissipation chambers (first heat dissipation chamber and second heat dissipation chamber) with different functions. The first chamber handles normal heat dissipation while the second chamber provides emergency heat storage, allowing the system to maintain compact size while addressing heat management challenges through functional division.
Solution Approach 2:
The patent introduces a vertical dimension to heat dissipation by stacking heat dissipation chambers above the circuit board rather than only lateral expansion. The heat storage portion is positioned in the vertical space above the circuit board, utilizing the Z-axis dimension to provide heat storage capacity without increasing the device's footprint area.
2Temperature
If conventional heat dissipation path is used, then normal heat dissipation is achieved, but short-time heat storage capability is insufficient
Solution Approach 1:
The heat storage portion is pre-positioned above the circuit board within the housing, ready to receive and store heat surges before they occur. This preliminary preparation of the heat storage system ensures that when short-time high-power operations generate excessive heat, the storage capacity is already in place to immediately absorb the thermal energy, preventing temperature spikes and component damage.
Solution Approach 2:
The heat storage portion acts as an intermediary thermal buffer between the heat-generating electronic components and the external environment. It mediates the thermal energy flow by temporarily storing excess heat during high-power operations and gradually releasing it during normal operations, smoothing out thermal fluctuations and protecting components from thermal stress.
3Reliability
If heat storage portion is added, then short-time heat storage capability is improved, but device complexity increases
Solution Approach 1:
The heat storage portion serves multiple functions: it acts as a thermal buffer for short-time heat storage, provides structural support as part of the housing, and facilitates heat transfer to external dissipation paths. By making the heat storage component multi-functional, the patent reduces the need for separate dedicated structures, thereby limiting the increase in device complexity while achieving improved heat storage capability.
Solution Approach 2:
The heat storage portion is nested within the existing housing structure above the circuit board, utilizing the available vertical space rather than requiring additional external components. This nesting approach integrates the heat storage function into the existing device architecture, minimizing the increase in overall device complexity while achieving the desired heat storage capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The heat storage portion effectively manages short-time heat surges, preventing component damage and improving the reliability and service life of the packaged device.
Implementation Method 1
the heat storage portion is configured to store and release heat
Implementation Method 2
a specific heat capacity of the heat storage portion is higher than a specific heat capacity of the circuit board
Implementation Method 3
Heat generated by the electronic component 2′ during working is transferred to the heat dissipation apparatus 200′ via the conducting layer 11′, the insulating substrate 12′, and the heat conducting layer 13′
Implementation Method 4
the metal layer is coupled to a radiator, and is configured to diffuse heat inside the power semiconductor device to the radiator, to implement heat dissipation
Data Source
AI summary
A packaged device includes a circuit board, an electronic component, and a heat storage portion. The electronic component is electrically coupled to the circuit board; and the heat storage portion is disposed on the circuit board or embedded in the circuit board, and the heat storage portion is adjacent to the electronic component, where a specific heat capacity of the heat storage portion is higher than a specific heat capacity of the circuit board, and the heat storage portion is configured to store and release heat. A heat storage material with a relatively high specific heat capacity is introduced into the packaged device, and the heat storage portion is disposed on the circuit board around the electronic component where a large amount of heat generated by the electronic component in a short time can be quickly stored in the heat storage portion and then released to the outside.