Semiconductor Package Heat Transmitting Structure for Thermal Management
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Solution Overview
Problem
Semiconductor package structures face challenges in efficiently dissipating heat due to their small size, leading to performance degradation or failure, as conventional methods like fans and thermal interface materials do not effectively address heat generated at the center of the package.
Innovation Solution
A substrate structure with a heat transmitting structure is integrated into the package, thermally connected to both the heat dissipating device and electronic devices, utilizing a grid-like arrangement of metal strips and heat pipes to enhance heat dissipation by transmitting heat from the center to the periphery for efficient dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the semiconductor package structure is made small to reduce footprint, then the area is reduced, but heat dissipation capability deteriorates
Solution Approach 1:
The patent introduces a heat transmitting structure that extends in the vertical dimension (thickness direction) beyond the package substrate surface. This allows heat dissipation to occur in three dimensions rather than being constrained to the two-dimensional plane of the small footprint package, effectively resolving the contradiction between small area and heat dissipation capability.
Solution Approach 2:
The heat transmitting structure is divided into multiple segments including metal strips arranged in grid patterns, heat pipes, and thermal interface materials. This segmentation allows heat to be transmitted through multiple parallel pathways from the semiconductor die to the package exterior, enhancing overall heat dissipation capability within the limited footprint.
2Device complexity
If conventional heat dissipation methods (fans, thermal interface materials) are used, then the structure remains simple, but heat dissipation efficiency is insufficient
Solution Approach 1:
The patent employs a composite heat transmitting structure combining multiple materials with different thermal properties: metal strips (high thermal conductivity), heat pipes (phase change heat transfer), and thermal interface materials (filling gaps and improving contact). This composite approach achieves superior heat dissipation efficiency while maintaining reasonable structural complexity.
Solution Approach 2:
The heat transmitting structure acts as an intermediary between the semiconductor die (heat source) and the package exterior (heat dissipation surface). This intermediate heat transmission pathway efficiently bridges the thermal gap, enabling effective heat removal without requiring complex active cooling systems like fans.
3Reliability
If heat is not dissipated efficiently, then the device can operate, but performance decreases or device fails
Solution Approach 1:
The heat transmitting structure is pre-integrated into the package substrate during manufacturing, establishing heat dissipation pathways before the semiconductor device operates. This preliminary heat transmission infrastructure ensures that heat can be efficiently removed from the outset, preventing performance degradation and maintaining reliable operation throughout the device lifecycle.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly improves heat dissipation efficiency, reducing the temperature of the semiconductor package structure and ensuring even temperature distribution, thereby preventing performance degradation and failure.
Implementation Method 1
The heat transmitting structure is disposed adjacent to the second surface of the package substrate, and thermally connected to the electronic device and the heat dissipating device
Implementation Method 2
utilizing a grid-like arrangement of metal strips and heat pipes to enhance heat dissipation by transmitting heat from the center to the periphery
Data Source
AI summary
A semiconductor package structure includes a package substrate, at least one semiconductor die, a heat dissipating device, at least one electronic device and a heat transmitting structure. The package substrate has a first surface and a second surface opposite to the first surface. The semiconductor die is electrically connected to the first surface of the package substrate. The heat dissipating device is thermally connected to the first surface of the package substrate. The electronic device is electrically connected to the second surface of the package substrate. The electronic device has a first surface and a second surface opposite to the first surface, and the first surface of the electronic device faces the second surface of the package substrate. The heat transmitting structure is disposed adjacent to the second surface of the package substrate, and thermally connected to the electronic device and the heat dissipating device.