Semiconductor Package Trenches for 3D Heat Distribution
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Solution Overview
Problem
Three-dimensional (3D) packaging or chip stacking in integrated circuits faces challenges in heat dissipation due to vertical integration, leading to performance degradation and hot spots, as existing structures are inadequate for efficient heat dissipation.
Innovation Solution
Incorporating a plurality of trenches in semiconductor substrates filled with a liquid or highly thermally conductive metal, sealed by a sealing layer to enhance heat dissipation and distribution within the package structure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If 3D packaging or chip stacking is implemented to increase efficiency and make better use of available space, then productivity and space utilization are improved, but heat dissipation capability deteriorates leading to hot spots and performance degradation
Solution Approach 1:
The substrate is segmented by forming multiple trenches that divide the heat generation region into separate zones. Each trench acts as an independent heat management unit, allowing heat to be distributed and dissipated more effectively across the substrate area, preventing hot spot formation while maintaining 3D packaging density
Solution Approach 2:
A liquid or highly thermally conductive metal is introduced as an intermediary substance within the trenches to facilitate heat transfer. This intermediary material bridges the heat source in the semiconductor devices and the heat dissipation paths, enabling efficient thermal management without compromising the vertical integration benefits
2Area of stationary object
If vertical integration is increased to improve space utilization, then area efficiency is improved, but heat accumulation worsens reducing performance
Solution Approach 1:
The heat dissipation approach transitions from a two-dimensional surface level problem to a three-dimensional solution by introducing vertical trenches within the substrate. This dimensional change allows heat to be managed through the substrate thickness, providing additional thermal pathways that do not occupy additional planar area, thus maintaining space efficiency while improving heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves heat dissipation capabilities, preventing performance degradation and reducing hot spots by effectively distributing heat through the substrate, thereby maintaining the efficiency of 3D package structures.
Implementation Method 1
Incorporating a plurality of trenches in semiconductor substrates filled with a liquid or highly thermally conductive metal
Data Source
AI summary
A semiconductor structure and processes of forming the same are provided. A semiconductor structure according to the present disclosure includes a first die having a front surface and a back surface and a second die bonded to the back surface of the first die. The first die includes a plurality of trenches adjacent the back surface and the plurality of trenches are filled with a liquid.