Semiconductor Package Through-Hole Alignment for Cleaner Signal Paths
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Solution Overview
Problem
Existing semiconductor package devices face challenges in aligning through holes in substrates and plastic members, leading to contamination risks and inefficiencies in signal transmission.
Innovation Solution
The semiconductor package device incorporates a substrate with aligned holes extending through both the substrate and a dielectric layer, allowing for efficient signal transmission and reducing contamination risks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a plastic member is attached to the substrate with through holes to facilitate external signal receiving, then signal transmission is enabled, but alignment precision deteriorates and contamination risk increases
Solution Approach 1:
The patent merges the substrate and plastic member into a single integrated structure where the plastic member is formed as an extension of the substrate rather than being a separate attached component. The through holes are formed simultaneously in both the substrate and plastic member using a single masking and etching process, ensuring perfect alignment and eliminating the need for separate alignment operations.
Solution Approach 2:
The patent applies preliminary action by forming the through holes in the substrate and plastic member before the plastic member is fully attached or integrated. The masking layer is applied and patterned in advance to define the through hole positions, and the holes are etched through both layers simultaneously, establishing precise alignment before final assembly or operation.
2Ease of operation
If a plastic member is attached to the substrate with through holes, then external signal receiving is facilitated, but device complexity increases
Solution Approach 1:
The patent combines the substrate and plastic member into a unified structure where the plastic member serves as both a structural component and a signal transmission pathway. The through holes provide mechanical support and signal transmission functions simultaneously, reducing the need for separate components and simplifying the overall device architecture.
Solution Approach 2:
The plastic member is designed to perform multiple functions: it provides structural support, defines the through hole geometry, facilitates external signal receiving, and serves as a bonding interface with the substrate. This multi-functionality reduces the total number of components needed and simplifies the device structure.
3Ease of manufacture
If through holes are formed in substrate and plastic member separately, then manufacturing flexibility is maintained, but production efficiency decreases
Solution Approach 1:
The patent applies preliminary action by forming the through holes in the substrate and plastic member before final assembly or integration. The masking layer is applied and patterned in advance to define the through hole positions, and the holes are etched through both layers simultaneously, establishing precise alignment before final assembly or operation.
Solution Approach 2:
The patent merges the formation of through holes in the substrate and plastic member into a single simultaneous process step. The masking layer covers both the substrate and plastic member, and a single etching operation creates through holes in both materials at the same time, eliminating the need for separate hole formation operations and significantly improving production efficiency.
Data Source
AI summary
A semiconductor package device and a method of manufacturing a semiconductor package device are provided. The semiconductor package device includes a substrate, a first electronic component, a first dielectric layer, and a first hole. The substrate has a first surface and a second surface opposite to the first surface. The first electronic component is disposed on the first surface. The first dielectric layer is disposed on the second surface and has a third surface away from the substrate. The first hole extends from the first dielectric layer and the substrate. The first hole is substantially aligned with the first electronic component.