Semiconductor Package Structure With Hollow Cylinders for Drill-Free Vias
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Solution Overview
Problem
Current wafer-level packaging methods face challenges in efficiently producing through holes in package structures without causing mechanical strain or heat damage, which can lead to increased costs and reduced yield due to the need for mechanical or laser drilling processes.
Innovation Solution
The method involves forming hollow cylinders around semiconductor dies, encapsulating them with an insulating material, and then removing the lids to create through holes, eliminating the need for drilling and reducing mechanical strain, while using a redistribution layer and thermal module for further structural support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If mechanical or laser drilling processes are used to create through holes, then through holes can be formed in the package structure, but mechanical strain or heat damage occurs leading to increased costs and reduced yield
Solution Approach 1:
The patent applies preliminary action by forming hollow cylinders around semiconductor dies during the wafer-level packaging process, before the需要通过钻孔创建通孔的步骤。这些预形成的空心圆柱体随后通过去除端盖创建通孔，避免了在封装完成后进行机械或激光钻孔，从而消除了钻孔过程对封装结构的机械应变或热损伤
Solution Approach 2:
The patent applies the extraction principle by removing the end caps of the pre-formed hollow cylinders to create through holes. This extracts the hole-creation function from the drilling process itself, replacing it with a simpler cap removal operation that does not cause mechanical strain or heat damage to the package structure
2Manufacturing precision
If mechanical or laser drilling processes are used to create through holes, then through holes can be formed, but production costs increase due to damage and rework
Solution Approach 1:
The hollow cylinders are formed during the wafer-level packaging process itself, before final assembly. This preliminary formation of the cylinder structures eliminates the need for subsequent drilling operations, reducing manufacturing steps and associated costs while maintaining precise through hole creation
Solution Approach 2:
By extracting the hole-creation function to a cap removal operation rather than drilling, the patent eliminates expensive drilling equipment, tooling, and rework costs associated with damaged holes, thereby reducing overall production costs while achieving the same manufacturing precision
Data Source
AI summary
A package structure includes at least one semiconductor die, a plurality of hollow cylinders, an insulating encapsulant, a redistribution layer and through holes. The plurality of hollow cylinders is surrounding the at least one semiconductor die. The insulating encapsulant has a top surface and a bottom surface opposite to the top surface, wherein the insulating encapsulant encapsulates the at least one semiconductor die and the plurality of hollow cylinders. The redistribution layer is disposed on the top surface of the insulant encapsulant and over the at least one semiconductor die. The through holes are penetrating through the plurality of hollow cylinders.