Semiconductor Package Sealing for Immersion Cooling Heat Transfer
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Solution Overview
Problem
Conventional air-cooled heat dissipation in data centers is inefficient, and immersive liquid cooling using electronic fluorinated liquids can adversely affect thermal interface materials in servers, compromising their reliability and heat dissipation effectiveness.
Innovation Solution
An electronic device design that includes a semiconductor device with a housing and sealing member to isolate electronic fluorinated liquid from thermal interface materials, using a sealing member between the housing and heat dissipation member, and between the housing and substrate, to prevent liquid contact and ensure reliable heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If immersive liquid cooling using electronic fluorinated liquid is used to improve heat dissipation efficiency, then heat dissipation efficiency is improved, but thermal interface material reliability deteriorates due to adverse effects from the liquid
Solution Approach 1:
The housing is divided into a first side wall and a second side wall that are spaced apart, creating a sealed chamber structure. This segmentation allows the thermal interface material to be isolated from the electronic fluorinated liquid while maintaining efficient heat transfer, resolving the contradiction between heat dissipation efficiency and material reliability
Solution Approach 2:
The sealed housing acts as an intermediary barrier between the electronic fluorinated liquid and the thermal interface material. It allows thermal energy to pass through while preventing direct contact between the liquid cooling medium and the thermal interface material, thus maintaining both heat dissipation efficiency and material reliability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents electronic fluorinated liquid from contacting thermal interface materials, ensuring their reliability and maintaining efficient heat dissipation in servers immersed in the liquid cooling medium.
Implementation Method 1
a sealing member is disposed between the first side wall and the second side wall, and the sealing member is sealing between the housing and the heat dissipation member, and between the housing and the substrate
Implementation Method 2
a first thermal interface material is disposed between the semiconductor device and the heat dissipation member
Data Source
AI summary
The electronic device includes: a circuit board; a heat dissipation member, spaced apart from the circuit board; and a semiconductor device, located between the circuit board and the heat dissipation member, where the semiconductor device is electrically connected to the circuit board, and a first thermal interface material is disposed between the semiconductor device and the heat dissipation member, where the semiconductor device includes: a substrate, connected to the circuit board; a die, connected to a surface that is of the substrate and that faces away from the circuit board; and a housing, fixed to the substrate and around the die, where the housing includes a first side wall and a second side wall, a sealing member is disposed between the first side wall and the second side wall, and the sealing member is sealing between the housing and the heat dissipation member, and between the housing and the substrate.