Semiconductor Package Wiring Layout for Stable Impedance and EMI Control
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Solution Overview
Problem
Existing semiconductor element packages suffer from electromagnetic interference and signal degradation due to unspecific electric field coupling and unstable characteristic impedance at the ends of signal wiring conductors, leading to increased loss and electromagnetic interference.
Innovation Solution
The package incorporates a design with holes in the dielectric layer between signal wiring conductors, reducing electric field coupling and stabilizing characteristic impedance by using a ceramic material with controlled dielectric properties, and adjusting the hole dimensions and positions to achieve desired impedance values.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a groove is provided in the dielectric substrate between line conductors to reduce capacitance and electromagnetic interference, then electrical interference is reduced, but the end portions of line conductors become weakly coupled and couple to unspecified conductors causing electromagnetic field disturbance
Solution Approach 1:
The patent applies local quality by providing a ground conductor layer specifically at the end portions of the line conductors where coupling is needed, while maintaining separation in other regions. This localized grounding approach ensures stable electromagnetic field coupling at critical points without creating continuous coupling that would increase overall capacitance and electromagnetic interference between adjacent line conductors.
Solution Approach 2:
The ground conductor layer acts as an intermediary element that mediates the electromagnetic field interaction at the end portions of line conductors. By introducing this intermediate grounding structure, the patent stabilizes the electromagnetic field coupling without requiring direct coupling between signal conductors, thus avoiding excessive capacitance while preventing weak coupling to unspecified conductors.
2Loss of energy
If end portions of line conductors are weakly coupled together, then capacitance between conductors is reduced, but coupling to unspecified conductors occurs causing electromagnetic field disturbance and signal loss
Solution Approach 1:
The patent applies preliminary anti-action by preemptively providing a ground conductor layer at the end portions of line conductors before weak coupling to unspecified conductors can occur. This preventive grounding structure counteracts the tendency of line conductors to couple to nearby conductors, thereby stabilizing the electromagnetic field and preventing signal loss due to field disturbance.
Solution Approach 2:
The patent changes the electromagnetic field parameters by introducing a ground conductor layer that modifies the field distribution and coupling characteristics at the end portions of line conductors. This parameter change stabilizes the characteristic impedance and electromagnetic field stability without significantly increasing the capacitance between signal-bearing conductors.
3Reliability
If ground conductor layers are provided on both sides of signal wiring conductors, then electromagnetic field coupling is stabilized, but device complexity increases
Solution Approach 1:
The patent applies segmentation by providing ground conductor layers only at specific segments (end portions) of the line conductors rather than continuous grounding along the entire length. This segmented approach stabilizes the characteristic impedance at critical points where signals are transmitted, while avoiding the complexity of continuous ground structures throughout the entire wiring path.
Solution Approach 2:
The patent applies partial action by providing ground conductor layers only where necessary (at the end portions of line conductors) rather than excessive continuous grounding. This partial grounding approach provides sufficient electromagnetic field stability and characteristic impedance control without the added complexity and capacitance increase that would result from complete continuous grounding.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses electromagnetic interference and improves signal transmission characteristics by maintaining consistent impedance and reducing electromagnetic interference, allowing for high-density wiring and improved high-frequency performance.
Implementation Method 1
using a ceramic material with controlled dielectric properties
Implementation Method 2
reduces electric field coupling and stabilizing characteristic impedance
Implementation Method 3
suppresses electromagnetic interference and improves signal transmission characteristics by maintaining consistent impedance and reducing electromagnetic interference
Data Source
Figure 1
Figure 2
Figure 3A~3B
AI summary
A semiconductor element package includes a base body, a frame member, and a terminal member. The frame member is provided on a main surface of the base body. A notch is formed on the base body side of this frame member. The notch is a gap between the one main surface of the base body and the frame member. The terminal member is provided so as to cover the notch as the gap. The terminal member includes a first dielectric layer, a plurality of signal wiring conductors and a plurality of coplanar ground conductor layers that are provided on one surface of the first dielectric layer, and a second dielectric layer. The first dielectric layer has a hole provided open in a region of the one surface between a first wiring conductor and a second wiring conductor.