Semiconductor Package Impedance Matching Element for Signal Integrity
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Solution Overview
Problem
Impedance mismatches in semiconductor packages lead to signal loss and reduced signal integrity, particularly in high-speed communications, due to the challenges of designing semiconductor packages with multiple chips communicating effectively.
Innovation Solution
The implementation of impedance matching elements, such as conductive vias and spiral inductors, between package balls and signal traces on the package substrate, which establish impedance matching with the termination impedance of semiconductor chips, thereby compensating for impedance mismatches and reducing signal reflection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor packages are designed with multiple chips for high-speed communications, then communication functionality is improved, but impedance mismatch occurs causing signal loss and reduced signal integrity
Solution Approach 1:
An impedance matching element is introduced as an intermediary component between the signal trace and the ball pad. This element acts as a mediator to transform the impedance levels, enabling proper signal transmission between chips with different termination impedances while maintaining signal integrity in multi-chip package configurations
Solution Approach 2:
The impedance matching element modifies the electrical parameter (impedance) of the signal path by providing a transformation ratio that matches the termination impedances of connected chips. This parameter change allows signals to be properly transmitted across interfaces with different impedance characteristics without causing reflections or signal loss
2Reliability
If impedance matching elements are added to compensate for impedance mismatches, then signal integrity is improved, but device complexity increases
Solution Approach 1:
The impedance matching element is designed to perform multiple functions: it provides impedance transformation while also serving as an electrical connection between layers. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity while still achieving signal integrity improvement
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively reduces signal reflection and enhances signal integrity by matching impedances, improving the performance of semiconductor device packages in high-speed communications.
Implementation Method 1
an impedance matching element connected between the ball pad and the signal trace. The impedance matching element is configured to establish impedance matching with a termination impedance of the semiconductor chip
Data Source
AI summary
A semiconductor device package includes a semiconductor chip mounted to an upper surface of a package substrate by a package ball. The package substrate includes a ball pad on the upper surface of the package substrate and connected to the package ball, a signal trace located below the upper surface of the package substrate, and an impedance matching element connected between the ball pad and the signal trace. The impedance matching element is configured to establish impedance matching with a termination impedance of the semiconductor chip.