Semiconductor Package Indication Patterns for Distance Measurement
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Solution Overview
Problem
The challenge lies in accurately measuring and maintaining the distance between a semiconductor chip and the side surface of a semiconductor package without using destructive or non-destructive X-ray analysis techniques, as existing methods are complex and inefficient, leading to potential reliability issues due to reduced package side margins and moisture infiltration.
Innovation Solution
Incorporating an indication pattern of bar patterns with varying lengths within the semiconductor package, which are exposed through the side surface or cut surface, allowing for the measurement of the distance between the semiconductor chip and the package side surface without the need for X-ray analysis, enabling easier sorting of good packages and realignment of the sawing blade.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If destructive or non-destructive X-ray analysis techniques are used to measure the distance between the semiconductor chip and the package side surface, then measurement accuracy is improved, but the process becomes complex and time-consuming
Solution Approach 1:
The patent applies the preliminary action principle by pre-forming indication patterns (bar patterns of varying lengths) within the encapsulant layer during the package fabrication process. These patterns serve as built-in reference markers that enable direct visual measurement of the distance between the semiconductor chip and the package side surface, eliminating the need for complex post-fabrication X-ray analysis techniques.
Solution Approach 2:
The patent uses the copying principle by creating visual replicas (indication patterns) of distance information within the encapsulant layer. These bar patterns represent different distance measurements in a visible format, allowing operators to determine chip-to-side-surface distances by simple visual inspection rather than requiring sophisticated imaging equipment.
2Volume of moving object
If the package size is reduced to meet shrinking electronic device requirements, then the package becomes more compact, but the distance between the semiconductor chip and the side surface decreases leading to reliability issues
Solution Approach 1:
The patent applies preliminary action by pre-establishing indication patterns that define minimum safe distance thresholds during package fabrication. These patterns allow for real-time verification that the chip is positioned at an adequate distance from the side surface, enabling quality control measures to prevent reliability issues before they occur.
Solution Approach 2:
The indication patterns provide visual feedback mechanisms that allow operators to immediately assess whether the chip positioning meets minimum distance requirements. This feedback enables corrective actions to be taken during assembly or packaging processes to maintain reliability even as overall package dimensions are reduced.
3Volume of moving object
If the distance between the semiconductor chip and the package side surface is reduced, then the package becomes more compact, but moisture infiltration risk increases
Solution Approach 1:
The patent uses preliminary action by incorporating indication patterns that mark critical distance thresholds before packaging is complete. These patterns enable verification that sufficient protective spacing is maintained between the chip and the package exterior, ensuring that moisture barriers remain effective even in compact designs.
4Measurement precision
If X-ray analysis techniques are used to obtain chip position information, then accurate measurement is achieved, but the process becomes time-consuming and requires specialized equipment
Solution Approach 1:
The patent applies the copying principle by creating visible visual replicas of distance information through indication patterns embedded in the encapsulant layer. These patterns allow operators to determine chip position and distance measurements through simple visual inspection or basic imaging, replacing the need for time-consuming X-ray analysis and specialized equipment.
Solution Approach 2:
The indication patterns serve as disposable visual markers that are formed once during package fabrication and then used repeatedly for quality verification. This eliminates the need for expensive, time-consuming analytical techniques for each individual package inspection.
Data Source
AI summary
A semiconductor package includes a package substrate, a first semiconductor chip on the package substrate, an encapsulant layer covering the first semiconductor chip, bar patterns disposed within the package substrate, each bar pattern having a first end and a second end. An encapsulant layer formed to cover at least the bar patterns and the first semiconductor chip, wherein the semiconductor package having the encapsulant layer has a side surface with exposing one or more second ends of the bar patterns, wherein the bar patterns having different lengths are positioned substantially along a predetermined direction with respect to the first semiconductor chip such that the one or more second ends of the bar patterns exposed through the side surface of the semiconductor package indicate a distance between the side surface and the first semiconductor chip.