Semiconductor Package Inductor Layout for Reduced Pattern Interference
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Solution Overview
Problem
As integrated circuit packages become increasingly complex with multiple device dies packaged together, there is a need for efficient methods to form semiconductor packages that optimize device performance and manufacturing costs, while also allowing for the integration of different technologies and functions within the same package.
Innovation Solution
The method involves forming a semiconductor package with a semiconductor substrate, interconnect structure, and bonding structure, where a die is bonded to the package, and an inductor is formed in a separate region, using conductive patterns and dielectric layers to create a spiral structure, allowing for efficient electrical connections and encapsulation, which reduces interference and enhances yield and performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple device dies are packaged in the same package to achieve more functions, then the device functionality and integration are improved, but the manufacturing complexity and interference between components increase
Solution Approach 1:
The patent divides the semiconductor package into distinct functional regions: a first region for bonding the device die and a second region for forming the inductor. This spatial segmentation allows different technologies and functions to be integrated in the same package while minimizing interference between components and simplifying the manufacturing process by allowing independent formation of each component in its designated region.
2Reliability
If conductive patterns are formed to connect device dies, then electrical connections are established, but interference between conductive patterns increases
Solution Approach 1:
The patent extracts the inductor formation process from the device die bonding region and places it in a separate second region. This separation removes the source of electromagnetic interference from the sensitive bonding region, allowing reliable electrical connections to be established without interference from nearby conductive patterns used in inductor formation.
3Productivity
If different technologies are integrated in the same package, then manufacturing cost is reduced and performance is optimized, but the process complexity increases
Solution Approach 1:
The patent applies different manufacturing processes to different regions of the package: device die bonding processes are applied in the first region while inductor formation processes are applied in the second region. This localized approach allows different technologies to be integrated in the same package with optimized processes for each function, reducing overall process complexity while maintaining manufacturing efficiency.
Data Source
AI summary
Semiconductor packages are provided. One of the semiconductor packages includes an integrated circuit, a die, an encapsulant and an inductor. The die is bonded to the integrated circuit. The encapsulant encapsulates the die over the integrated circuit. The inductor includes a plurality of first conductive patterns and a plurality of second conductive patterns. The first conductive patterns penetrate through the encapsulant. The second conductive patterns are disposed over opposite surfaces of the encapsulant. The first conductive patterns and the second conductive patterns are electrically connected to one another to form a spiral structure having two ends.