Semiconductor Package Insulating Spacers for Void-Free Mounting
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Solution Overview
Problem
During the mounting of semiconductor elements on a package substrate, insufficient spacing can lead to voids in the molding member and the presence of foreign substances, causing potential short circuits due to inadequate distance between the semiconductor elements and the substrate.
Innovation Solution
The implementation of insulating structures with a stepping stone configuration on the package substrate, comprising a lower and upper insulator, to increase the spacing between the semiconductor elements and the substrate, thereby preventing voids and foreign substances from forming.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the spacing distance between semiconductor elements and package substrate is reduced, then mounting density is improved, but voids occur in molding member and foreign substances remain causing short circuiting
Solution Approach 1:
An insulating structure is introduced as an intermediary component between the semiconductor element and the package substrate. This mediator maintains electrical isolation and prevents short circuits while enabling closer spacing, thus resolving the contradiction between mounting density and reliability.
Solution Approach 2:
The insulating structure extends in the vertical dimension (thickness direction) to provide sufficient spacing distance. By utilizing the vertical dimension rather than increasing horizontal spacing, the patent achieves both high mounting density and reliable electrical isolation.
2Reliability
If insulating structures are added to increase spacing, then reliability is improved by preventing voids and foreign substances, but device complexity increases
Solution Approach 1:
The insulating structure is merged with the existing substrate structure by forming it on the substrate surface using the same or similar materials and processes. This integration approach adds the necessary insulation function without significantly increasing overall device complexity.
Solution Approach 2:
The insulating structure is formed in advance during the substrate fabrication process, before semiconductor element mounting. This preliminary action ensures the spacing structure is already in place, simplifying subsequent assembly steps and reducing overall manufacturing complexity.
3Manufacturing precision
If insulating structures are formed with multiple layers, then spacing precision is improved, but manufacturing time increases
Solution Approach 1:
Multiple insulating layers are formed by repeating the same deposition and patterning processes, merging the fabrication steps into a standardized sequence. This approach achieves precise spacing control while maintaining manufacturing efficiency through process repetition rather than developing entirely new multi-step procedures.
Data Source
AI summary
A semiconductor package includes a package substrate having a first surface and a second surface opposite to each other, the package substrate comprising a plurality of first substrate pads and a plurality of second substrate pads that are exposed from the first surface; a semiconductor device mounted on the first surface of the package substrate; at least one semiconductor element on the package substrate, the at least one semiconductor element spaced apart from the semiconductor device, the at least one semiconductor element being mounted on the package substrate via solder members that are disposed on the plurality of second substrate pads; and a plurality of insulating structures on the first surface of the package substrate to space a lower surface of the at least one semiconductor element from the first surface of the package substrate.