Semiconductor Package Layout for High-Voltage Insulation Paths
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Solution Overview
Problem
In semiconductor devices with multiple elements in one package, the difference in power supply voltage between the control and drive elements leads to a need for improved insulation withstand voltage between conduction paths, as existing solutions fail to adequately address the potential difference and ensure reliable operation.
Innovation Solution
A semiconductor device design featuring a conductive support with distinct die pads for control and drive elements, along with a sealing resin that covers the elements and terminals, includes an insulating part to relay signals and insulate the control and high-voltage drive circuits, and strategically arranged terminals to enhance insulation distance and creepage distance, preventing conductive support exposure from certain surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor elements are mounted in one package with different power supply voltages, then integration density is improved, but insulation withstand voltage between conduction paths deteriorates
Solution Approach 1:
The package is segmented into distinct conduction paths with separate die pads (first die pad for control element, second die pad for drive element) that are spatially separated and electrically isolated. The sealing resin is also segmented to cover different regions, creating isolated zones for low-voltage and high-voltage circuits while maintaining integration within a single package.
Solution Approach 2:
The sealing resin acts as an intermediary insulating material between the first and second die pads, and between different conduction paths. This resin layer provides the necessary electrical isolation while allowing both high-voltage and low-voltage circuits to coexist in the same package, resolving the contradiction between integration and insulation.
2Area of stationary object
If die pads are placed closer together to reduce package size, then area is reduced, but insulation distance between conduction paths deteriorates
Solution Approach 1:
Instead of increasing insulation distance only in the planar direction (which would increase package area), the solution extends insulation into the thickness dimension by using a sealing resin that covers the top surface and sides of the die pads. This creates a three-dimensional insulation barrier that maintains small planar footprint while ensuring adequate insulation distance.
Solution Approach 2:
The sealing resin forms a composite insulating structure that combines multiple functional layers, providing both mechanical protection and electrical insulation. This composite approach allows compact packaging while maintaining the required insulation performance through the multi-layer resin structure.
Data Source
AI summary
There is provided a semiconductor device including: a conductive support including a first die pad and a second die pad having a potential different from a potential of the first die pad; a first semiconductor element mounted on the first die pad; a second semiconductor element mounted on the second die pad; and a sealing resin that covers the first semiconductor element, the second semiconductor element, and at least a portion of the conductive support.