Resin-Molded Semiconductor Package With Non-Adhering Insulation Zones
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Solution Overview
Problem
Existing semiconductor devices with resin molded enclosures face issues with insulation, leading to potential electric shocks due to exposed die pad parts, requiring multiple resin application steps to prevent shocks.
Innovation Solution
A semiconductor device design featuring a semiconductor circuit base on an insulating substrate with a reinforcement and balance base, spaced apart and insulated from each other, is sealed within a resin-molded enclosure with a non-adhering resin portion, preventing the need for additional resin filling to maintain insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If resin is injected into the molding die to seal the semiconductor device, then the die pad and semiconductor element are enclosed, but parts of the die pad are exposed due to protrusions on the molding die preventing resin adhesion
Solution Approach 1:
The patent applies preliminary action by pre-coating the protrusions on the molding die with a release agent before resin injection. This preliminary coating prevents resin adhesion to the protrusions, ensuring that the resin flows smoothly and completely encloses the die pad without leaving exposed portions, thereby eliminating the need for subsequent resin application steps.
2Reliability
If resin is applied multiple times to cover exposed die pad parts, then insulation is maintained and electric shock is prevented, but the manufacturing process becomes complex and time-consuming
Solution Approach 1:
The patent eliminates the need for multiple resin application steps by pre-coating the protrusions with a release agent before resin injection. This single preliminary action ensures complete resin adhesion to the molding die surfaces that require bonding, while preventing adhesion to protrusions, thereby achieving complete enclosure and insulation in one resin injection process.
Solution Approach 2:
The patent introduces a release agent as an intermediary substance applied to the protrusions on the molding die. This intermediary prevents the resin from adhering to the protrusions, allowing the resin to flow around and completely enclose the die pad without creating exposed portions, thereby simplifying the manufacturing process to a single resin application step.
3Shape
If protrusions are formed on the molding die to push the frame into the die, then the frame is properly positioned, but resin cannot adhere to these protrusions causing exposure of die pad parts
Solution Approach 1:
The patent applies a release agent as an intermediary coating on the protrusions that are necessary for frame positioning. This coating allows the protrusions to maintain their mechanical function of pushing and positioning the frame into the die, while simultaneously preventing resin adhesion to these protrusions, ensuring complete resin enclosure of the die pad without exposed portions.
Data Source
AI summary
A semiconductor chip is provided on a semiconductor circuit base on one surface of an insulating substrate. A reinforcement and balance base is provided on the one surface of the insulating substrate spaced to the semiconductor circuit base. The insulating substrate 4, the semiconductor circuit base, the semiconductor chip, and the reinforcement and balance base are sealed into a resin-molded sealing body. The sealing body has resin non-adhering portions.