Semiconductor Package With Integrated Antenna and EMI Shield
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Solution Overview
Problem
Conventional semiconductor packaging in wireless devices requires separate manufacturing of antennas and communication modules, leading to higher costs and difficulties in achieving compact designs, while also being prone to electromagnetic interference (EMI) that can degrade signal performance.
Innovation Solution
A semiconductor package design that integrates an antenna on a dielectric structure with an electromagnetic interference shield, a feeding element, and an antenna grounding element, allowing for concurrent manufacturing and reduced size, while also providing effective EMI shielding through a grounding frame and high permittivity dielectric material layers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If antenna and communication module are separately manufactured and assembled, then manufacturing flexibility is maintained, but manufacturing costs increase and device size increases
Solution Approach 1:
The patent combines the antenna and communication module into a single integrated semiconductor package. The antenna is formed on the package substrate alongside the communication module, eliminating the need for separate manufacturing and assembly processes. This merging reduces manufacturing costs and simplifies the overall assembly complexity while maintaining functional independence of both components.
2Volume of moving object
If antenna and communication module are separately manufactured, then design flexibility is maintained, but product compactness becomes more difficult to achieve
Solution Approach 1:
The patent utilizes the substrate plane and vertical stacking to integrate both the communication module and antenna within the same package footprint. The antenna is formed on the substrate in a planar configuration, while the communication module is positioned in the vertical dimension, effectively using three-dimensional space to reduce overall device size without compromising manufacturing feasibility.
3Object-affected harmful factors
If conventional EMI shielding frame is used, then electromagnetic interference protection is provided, but manufacturing complexity and cost increase
Solution Approach 1:
The package substrate serves multiple functions: it acts as the mounting platform for the communication module, the formation layer for the antenna, and simultaneously provides electromagnetic interference shielding through its ground plane and conductive structures. This multi-functionality eliminates the need for separate EMI shielding frames, reducing structural complexity and manufacturing cost while maintaining effective EMI protection.
4Object-affected harmful factors
If antenna is integrated on package substrate, then manufacturing cost is reduced and device size is minimized, but EMI protection requirements become more stringent
Solution Approach 1:
The EMI shielding structures, including ground planes and conductive shielding layers, are formed during the same manufacturing process as the antenna and communication module integration. The shielding structures are preliminarily established on the substrate before final assembly, ensuring that EMI protection is built-in from the outset rather than added as a separate post-processing step, thereby maintaining manufacturing ease while addressing EMI susceptibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces manufacturing costs, achieves a more compact form factor, and significantly minimizes electromagnetic interference, thereby enhancing signal quality and performance.
Implementation Method 1
an electromagnetic interference shield formed on the package body
Implementation Method 2
a dielectric structure covering the electromagnetic interference shield... wherein the permittivity of the dielectric material layer is higher than that of the dielectric structure
Data Source
AI summary
A semiconductor package includes a substrate, a semiconductor die, a package body, an electromagnetic interference shield, a dielectric structure and an antenna element. The substrate comprises a grounding segment and a feeding point. The semiconductor die is disposed on the substrate. The package body encapsulates the semiconductor die. The electromagnetic interference shield is formed on the package body. The dielectric structure encapsulates the electromagnetic interference shield. The antenna element is formed on the dielectric structure and electrically connecting the grounding segment of the substrate and the feeding point.