Semiconductor Package Structure with Integrated Dielectric Layers
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Solution Overview
Problem
The existing semiconductor package manufacturing processes face challenges in miniaturization, high-resolution lithography limitations due to non-smooth passivation layers, and increased costs due to separate packaging, board manufacturing, and assembly processes, which result in inefficient use of space and high failure rates.
Innovation Solution
A semiconductor package structure and method that incorporates a first and second dielectric layer, a component with electrical contacts, and patterned conductive layers, where conductive vias penetrate the dielectric layers to connect the component's contacts with the patterned conductive layers, allowing for high-resolution techniques to reduce via hole width and pad pitch, improving yield and reducing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional packaging processes are used, then the semiconductor device can be packaged and assembled, but the space occupied on the substrate is large and manufacturing costs are high
Solution Approach 1:
The patent combines the packaging process with the substrate manufacturing process into a single integrated process. The semiconductor device is packaged directly on the substrate using the same manufacturing line, eliminating the need for separate packaging and assembly steps. This merging of processes reduces both the space required on the substrate and the overall manufacturing cost by consolidating multiple operations into one.
Solution Approach 2:
The substrate serves multiple functions: it acts as both the mounting platform for the semiconductor device and the packaging structure itself. The substrate's surface is used for both circuitry and as the packaging substrate, eliminating the need for a separate packaging substrate. This multi-functionality reduces the total space required and simplifies the manufacturing process.
2Manufacturing precision
If high-resolution lithography is used, then via hole width and pad pitch can be reduced, but the process becomes more complex and costly
Solution Approach 1:
The passivation layer is formed with a smooth surface before the lithography process. This preliminary smoothing action creates an ideal surface for high-resolution lithography, allowing for reduced via hole width and pad pitch without requiring overly complex lithography processes. The smooth surface ensures uniform coating and patterning, enabling higher precision with manageable process complexity.
3Productivity
If separate packaging and assembly processes are used, then each process can be optimized independently, but the overall manufacturing cost increases and productivity decreases
Solution Approach 1:
The packaging process and substrate manufacturing process are merged into a single integrated process. The semiconductor device is packaged directly on the substrate using the same manufacturing line, eliminating the need for separate packaging and assembly steps. This consolidation increases productivity by reducing the number of process steps and handoffs, while also decreasing manufacturing cost through economies of scale and reduced overhead.
Data Source
AI summary
Disclosed is a semiconductor package structure and manufacturing method. The semiconductor package structure includes a first dielectric layer, a second dielectric layer, a component, a patterned conductive layer and at least two conductive vias. The first dielectric layer has a first surface and a second surface opposite the first surface. The second dielectric layer has a first surface and a second surface opposite the first surface. The second surface of the first dielectric layer is attached to the first surface of the second dielectric layer. A component within the second dielectric layer has at least two electrical contacts adjacent to the second surface of the first dielectric layer. The patterned conductive layer within the first dielectric layer is adjacent to the first surface of the first dielectric layer. The conductive vias penetrate the first dielectric layer and electrically connect the electrical contacts with the patterned conductive layer.