Semiconductor Package Thickness Reduction via Integrated Encapsulant Redistribution
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
In semiconductor packaging, the introduction of a connection member like an interposer increases the thickness of the package, which is a challenge in reducing the overall size while maintaining performance, especially in package-on-package (POP) structures where multiple connections need to be efficiently managed.
Innovation Solution
A semiconductor package design that incorporates a first connection member with an insulating member and a redistribution layer, an encapsulant with photosensitive insulating material, and a second redistribution layer with connection vias and through-vias, allowing for a simplified process and structure that reduces the need for additional interposers, thereby minimizing thickness and enhancing connection efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a connection member such as an interposer is introduced to connect connection terminals in a package-on-package structure, then the connection efficiency between upper and lower packages is improved, but the thickness of the semiconductor package increases
Solution Approach 1:
The patent merges the encapsulant and the second redistribution layer into an integrated structure, eliminating the need for a separate interposer connection member. The encapsulant itself is configured to provide electrical connections between the upper and lower packages through embedded conductive patterns, thereby maintaining connection efficiency while reducing package thickness.
Solution Approach 2:
The encapsulant is designed to serve multiple functions: it provides mechanical protection for the semiconductor chip, enables electrical redistribution through embedded conductive patterns, and establishes vertical connections between packages. This multi-functional design replaces the need for dedicated interposer structures, reducing overall package thickness while maintaining connectivity.
2Adaptability or versatility
If multiple connection members and interposers are used to manage multiple connections in POP structures, then the connection capability is improved, but the device complexity increases
Solution Approach 1:
The patent combines multiple functions into the encapsulant structure itself. The encapsulant integrates protection, redistribution, and vertical connection functions that would traditionally require separate components. The second redistribution layer is merged with the encapsulant, eliminating the need for separate interposer structures and reducing overall device complexity.
Solution Approach 2:
The encapsulant is designed as a multi-functional component that simultaneously provides mechanical protection, electrical redistribution, and vertical inter-package connectivity. This universal design approach allows the structure to handle multiple connections without requiring additional dedicated components, thereby reducing structural complexity while maintaining high connection capability.
3Length of moving object
If the package thickness is reduced by removing interposers, then the overall size is minimized, but the manufacturing precision requirements increase
Solution Approach 1:
By merging the redistribution layer with the encapsulant in an integrated structure, the patent eliminates the need for separate interposer alignment steps. The conductive patterns are formed directly within the encapsulant material, which simplifies the manufacturing process and reduces the cumulative alignment errors that would occur with multiple separate components.
Solution Approach 2:
The patent performs preliminary integration of the redistribution patterns into the encapsulant structure before final assembly. The encapsulant is configured with pre-formed conductive pathways that align with the semiconductor chip and upper package, reducing the need for high-precision alignment during final assembly and simplifying the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively suppresses the increase in thickness due to the interposer, enabling more compact and efficient semiconductor packages with improved thermal and electrical characteristics, suitable for mobile products and reducing signal paths in POP structures.
Implementation Method 1
an encapsulant disposed on the second surface of the first connection member, including a photosensitive insulating material
Data Source
AI summary
A semiconductor package includes a first connection member having a first surface and a second surface and including an insulating member and a first redistribution layer, a semiconductor chip connection electrodes disposed on the first connection member, an encapsulant on the second surface of the first connection member, including a photosensitive insulating material, and having a first region covering the active surface of the semiconductor chip and a second region in the vicinity of the semiconductor chip, a second redistribution layer including connection vias penetrating through the first region of the encapsulant, through-vias penetrating through the second region of the encapsulant, and a wiring pattern on the encapsulant and having an integrated structure with the connection vias and the through-vias, and a second connection member on the encapsulant including a third redistribution layer connected to the second redistribution layer.