Semiconductor Die Package With Integrated Leadframe Clip

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Solution Overview

Problem

Current semiconductor die packages face challenges with higher cost, inferior thermal performance, higher inductance, larger size, and lower integration due to the use of leadframe packages and copper clips, which hinder the development of smaller, more efficient power management devices.

Innovation Solution

A semiconductor die package design that incorporates a substrate, leadframe, and conductive clip, where the semiconductor die is positioned between the leadframe and the substrate, and the leadframe is disposed between the semiconductor die and the substrate, enabling a multi-chip module packaging with low resistance and high current capability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If leadframe packages and copper clips are used, then integration is achieved, but cost increases and thermal performance deteriorates

Engineering Contradiction:
ImproveintegrationVSAvoidcost
Core Design Contradiction:
Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The patent merges the leadframe and copper clip into a single integrated leadframe structure that incorporates clip functionality directly. The leadframe is designed with bent portions that extend through the molding layer to contact the semiconductor die, eliminating the need for separate copper clips while maintaining electrical connection and mechanical support functions.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The leadframe is designed to perform multiple functions simultaneously: providing mechanical support, establishing electrical connections, and enabling thermal dissipation. The integrated structure serves as both the package substrate and the connection element, replacing the need for separate copper clip components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Adaptability or versatility

If leadframe packages and copper clips are used, then integration is achieved, but thermal performance worsens

Engineering Contradiction:
ImproveintegrationVSAvoidthermal performance
Core Design Contradiction:
Adaptability or versatilityVSTemperature

Solution Approach 1:

The patent merges the leadframe and copper clip into a single integrated leadframe structure that incorporates clip functionality directly. The leadframe is designed with bent portions that extend through the molding layer to contact the semiconductor die, eliminating the need for separate copper clips while maintaining electrical connection and mechanical support functions.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The leadframe utilizes composite construction with copper or copper alloy materials that provide both electrical conductivity and thermal dissipation properties. The integrated structure combines mechanical support and electrical connection functions in a material system optimized for both electrical and thermal performance.

Inventive Principle:
Principle #40Composite materials

3Adaptability or versatility

If leadframe packages and copper clips are used, then integration is achieved, but inductance increases

Engineering Contradiction:
ImproveintegrationVSAvoidinductance
Core Design Contradiction:
Adaptability or versatilityVSObject-generated harmful factors

Solution Approach 1:

The patent merges the leadframe and copper clip into a single integrated leadframe structure that incorporates clip functionality directly. The leadframe is designed with bent portions that extend through the molding layer to contact the semiconductor die, eliminating the need for separate copper clips while maintaining electrical connection and mechanical support functions.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The leadframe employs a three-dimensional configuration with vertical leads extending through the molding layer and bent portions making contact with the semiconductor die. This spatial arrangement optimizes current paths and reduces loop area, thereby minimizing inductance through geometric optimization rather than material changes.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

4Adaptability or versatility

If leadframe packages and copper clips are used, then integration is achieved, but device size increases

Engineering Contradiction:
ImproveintegrationVSAvoiddevice size
Core Design Contradiction:
Adaptability or versatilityVSVolume of moving object

Solution Approach 1:

The patent merges the leadframe and copper clip into a single integrated leadframe structure that incorporates clip functionality directly. The leadframe is designed with bent portions that extend through the molding layer to contact the semiconductor die, eliminating the need for separate copper clips while maintaining electrical connection and mechanical support functions.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The leadframe utilizes thin, flexible metal structures that can be bent and shaped to provide mechanical support and electrical connections without adding significant volume. The slim profile of the integrated leadframe allows for compact packaging while maintaining structural integrity and electrical performance.

Inventive Principle:
Principle #30Flexible shells and thin films

Data Source

PatentUS11101198B2Semiconductor die package including a one-body clip
Publication Date: 2021.08.24 SEMICON COMPONENTS IND LLC
  • US11101198B2 patent drawing
  • US11101198B2 patent drawing
  • US11101198B2 patent drawing

AI summary

In one general aspect, an apparatus can include a semiconductor die, a substrate, and a leadframe coupled to the substrate and defining an opening. The apparatus can include a one-body clip having a first portion disposed within the opening and coupled to the semiconductor die. The one-body clip can have a second portion disposed within the same opening and coupled to the substrate.