Semiconductor Package Integrated Output Inductor Using Conductive Clips
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Solution Overview
Problem
Conventional semiconductor packages with pre-formed output inductors have a large form factor and poor thermal performance, increasing the size and thermal dissipation issues due to lateral placement with other components.
Innovation Solution
A semiconductor package with an integrated output inductor using conductive clips that form a continuous wire winding around a core, embedded within the package, reducing the overall size and enhancing thermal dissipation through a stacked architecture and exposed heatsinks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a pre-formed output inductor is used with lateral placement, then the inductor can be easily manufactured, but the package form factor increases and thermal performance deteriorates
Solution Approach 1:
The patent merges the output inductor with the power transistor package by integrating the inductor windings directly onto the leadframe structure. The leadframe itself serves as the inductor substrate, eliminating the need for separate pre-formed inductors and their associated mounting space. This integration reduces the overall package footprint while maintaining manufacturability through standardized leadframe fabrication processes.
Solution Approach 2:
The patent transitions from lateral placement to vertical stacking by arranging the inductor windings in multiple layers above and below the power transistor die. This three-dimensional configuration allows the inductor to occupy the vertical dimension rather than lateral space, significantly reducing the package footprint while maintaining the required inductance value.
2Ease of manufacture
If a pre-formed output inductor is used with lateral placement, then the inductor can be easily manufactured, but thermal dissipation performance worsens
Solution Approach 1:
The patent combines the inductor structure with the thermal management system by using the same leadframe and heatsink structures for both electrical and thermal functions. The exposed conductive clips that form part of the inductor structure are also thermally coupled to the power transistor die, creating an integrated thermal pathway that improves heat dissipation while maintaining inductor functionality.
Solution Approach 2:
The conductive clips and leadframe structures serve multiple functions simultaneously: they provide electrical connectivity for the inductor windings, mechanical support for the stacked components, and thermal conduction pathways for heat dissipation. This multi-functionality eliminates the need for separate thermal management components and improves overall thermal performance.
3Area of stationary object
If the output inductor is integrated with power transistors, then the package form factor is reduced, but the inductor form factor increases
Solution Approach 1:
The patent uses vertical stacking to accommodate the inductor volume within the package footprint. The inductor windings are arranged in multiple layers above and below the power transistor die, utilizing the vertical dimension to house the required inductance volume without increasing the lateral package dimensions. This results in a compact integrated package with improved power density.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integrated output inductor reduces the package form factor and improves thermal performance by embedding the inductor within the package and using exposed conductive clips as heatsinks for enhanced heat dissipation.
Implementation Method 1
conductive clips that form a continuous wire winding around a core
Implementation Method 2
using exposed conductive clips as heatsinks for enhanced heat dissipation
Data Source
AI summary
A semiconductor package includes a semiconductor die having a control transistor and a sync transistor, an integrated output inductor having a winding around a core, and coupled to the semiconductor die, where the winding includes a plurality of top conductive clips connected to a plurality of bottom conductive clips. The control transistor and the sync transistor are configured as a half-bridge. The integrated output inductor is coupled to a switched node of the half-bridge. At least one of the plurality of top conductive clips and the plurality of bottom conductive clips includes a partially etched portion and a non-etched portion. The semiconductor die is attached to the integrated output inductor by a die attach material. The semiconductor die and the integrated output inductor are encapsulated in a molding compound.