Semiconductor Package Interconnect Overlap for Heat and Contact Reliability
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Solution Overview
Problem
There is a demand for smaller and higher performing semiconductor chips with improved heat dissipation characteristics to enhance the reliability of high-performance semiconductor packages.
Innovation Solution
A semiconductor package design featuring a front redistribution structure with insulating and redistribution layers, a semiconductor chip, encapsulant, and an interconnection structure that overlaps and connects with the front pad, enhancing electrical characteristics and structural reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the interconnection structure uses a conventional flat bottom surface design, then the manufacturing process is simple, but the electrical contact area with the front pad is limited
Solution Approach 1:
The interconnection structure employs a curved bottom surface that overlaps with the front pad in both first and second directions, creating a curved contact interface rather than a flat one. This curvature increases the contact area between the interconnection structure and front pad, improving electrical contact reliability while the overall structure remains relatively simple to manufacture
2Reliability
If the interconnection structure overlaps only in the first direction (vertical), then the manufacturing process is simpler, but the electrical contact area and structural reliability are reduced
Solution Approach 1:
The interconnection structure extends overlap beyond the conventional single vertical dimension by overlapping the front pad in both the first direction (vertical) and the second direction (horizontal). This two-dimensional overlap arrangement enhances structural reliability and electrical contact area without significantly complicating the manufacturing process
3Power
If the semiconductor package uses larger chips to improve performance, then the processing power increases, but the heat dissipation becomes more difficult and reliability decreases
Solution Approach 1:
The interconnection structure with its extended overlap and curved bottom surface acts as an intermediary thermal management component between the front pad and the rear redistribution structure. This design facilitates heat dissipation from the semiconductor chip through enhanced thermal pathways, allowing higher processing power while maintaining acceptable temperature levels and reliability
Data Source
AI summary
A semiconductor package includes a front redistribution structure that includes a front pad, external connection bumps on the first redistribution structure, a semiconductor chip on the first redistribution structure, an encapsulant that is on the front redistribution structure and on a portion of the semiconductor chip, a rear redistribution structure that includes rear redistribution layers, and an interconnection structure that extends into the encapsulant and is electrically connecting the front pad and the rear redistribution layers, where the interconnection structure overlaps at least a portion of an upper surface of the front pad in a first direction that is perpendicular to the first surface of the front redistribution structure and overlaps at least a portion of a side surface of the front pad in a second direction that is parallel to the first surface of the front redistribution structure.