Semiconductor Package Structure With Interposer And Dual-Side Components
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Solution Overview
Problem
The increasing complexity and miniaturization of semiconductor devices lead to space and cost inefficiencies in packaging and assembly, along with issues of electromagnetic interference (EMI) affecting device performance.
Innovation Solution
A semiconductor package structure that combines components on both sides of a substrate with an interposer and electrical interconnects, encapsulated by a package body, which reduces space occupation and mitigates EMI through a conformal shield and grounding elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If semiconductor devices are miniaturized and packaged separately on substrates, then device density and processing speed are improved, but space occupation and manufacturing complexity increase
Solution Approach 1:
The patent combines the substrate, interposer, and package body into a single integrated structure. The substrate serves as both the mounting platform and the package housing, eliminating the need for separate packaging processes. This merging of functions reduces manufacturing complexity while maintaining high processing speeds through optimized electrical interconnects.
Solution Approach 2:
The patent utilizes three-dimensional stacking with components mounted on both the first and second surfaces of the substrate. The interposer extends vertically between surfaces, creating a multi-layer architecture that increases device density without expanding the horizontal footprint, thus improving speed while managing complexity.
2Reliability
If separate packaging and assembly processes are performed, then device functionality is ensured, but manufacturing cost and time increase
Solution Approach 1:
The interposer is pre-integrated with the substrate during substrate fabrication, establishing electrical interconnects before component mounting. This preliminary integration of critical interconnect structures allows components to be mounted directly without subsequent packaging steps, reducing manufacturing time while ensuring reliable electrical connections.
Solution Approach 2:
The package body is formed as an integral part of the substrate structure, combining the packaging function with the substrate itself. This eliminates separate packaging and assembly processes, reducing manufacturing time and steps while maintaining device functionality through the integrated design.
3Adaptability or versatility
If radio-emission devices are placed near semiconductor devices, then system functionality is enhanced, but electromagnetic interference increases
Solution Approach 1:
The patent extracts radio-emission devices from the immediate vicinity of sensitive semiconductor devices by placing them on opposite surfaces of the substrate or in separate regions. The interposer and package body create physical separation, isolating EMI sources while maintaining system functionality through controlled electrical interconnects.
Solution Approach 2:
The interposer serves as an intermediary structure between radio-emission devices and semiconductor devices. It provides electrical connection while physically separating the two, and can incorporate shielding or grounding elements to mitigate EMI. The package body also acts as an intermediary barrier, enclosing sensitive components and isolating them from electromagnetic interference.
Data Source
AI summary
The semiconductor package includes a substrate, a plurality of components, an interposer, an electrical interconnect and a first package body. The substrate has a first surface and a second surface opposite to the first surface. A first component is mounted on the first surface of the substrate, and a second component is mounted on the second surface of the substrate. The interposer has a first surface. The electrical interconnect connects the first surface of the interposer to the second surface of the substrate. The first package body is disposed on the second surface of the substrate and encapsulates the second component, the electrical interconnect and at least a portion of the interposer.