Semiconductor Package Warpage Reduction via Interposer and Non-Conductive Paste
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Solution Overview
Problem
Existing semiconductor packaging methods face challenges in minimizing warpage and reducing the pitch of connecting members, which affects the efficiency and reliability of electronic components.
Innovation Solution
A method involving a substrate with protruding connecting members, a non-conductive paste, and an interposer is used to form a non-conductive layer, which is then thermally pressed and cut into separate units, incorporating a pillar and solder to enhance bonding strength and reduce the pitch of connecting members.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connecting members are used to electrically connect upper and lower packages, then electrical connection is achieved, but warpage occurs in the semiconductor package
Solution Approach 1:
An interposer is introduced as an intermediary component between the substrate and the upper package. The interposer includes a non-conductive layer that provides mechanical support and electrical isolation, preventing warpage while enabling electrical connections through conductive vias and pads. This mediator resolves the conflict by decoupling the electrical connection function from the structural stability issue.
Solution Approach 2:
The connecting member is constructed as a composite structure with a non-conductive paste material body and conductive elements (solder balls, conductive vias) embedded within. This composite design allows the non-conductive portion to provide mechanical support and prevent warpage, while the conductive portions enable electrical connections, thus resolving the contradiction between structural stability and electrical connectivity.
2Ease of manufacture
If conventional packaging methods are used, then manufacturing is simpler, but pitch of connecting members cannot be reduced
Solution Approach 1:
The connecting member is segmented into distinct functional regions: a non-conductive paste body providing mechanical support, conductive vias for vertical electrical connections, and solder balls for inter-package bonding. This segmentation allows each component to be optimized independently, enabling reduced pitch while maintaining manufacturability through standardized processes for each segment type.
Solution Approach 2:
The invention changes the material parameters and geometric parameters of the connecting member. The non-conductive paste allows for smaller dimensions and tighter pitches compared to traditional substrates. The conductive vias and solder balls are precisely controlled in size and position, enabling reduced pitch while maintaining connection reliability. These parameter changes enable higher density packaging without sacrificing ease of manufacture.
3Quantity of substance
If more connecting members are used to reduce pitch, then number of I/O pins increases, but manufacturing complexity increases
Solution Approach 1:
The non-conductive paste material serves multiple functions simultaneously: it provides mechanical support, electrical isolation, adhesion between layers, and a matrix for embedding conductive elements. This multi-functionality reduces the need for separate structural and electrical components, allowing increased I/O pin count without proportionally increasing manufacturing complexity. The standardized multi-functional material simplifies the manufacturing process even as device complexity increases.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively minimizes warpage and reduces the pitch of connecting members, increasing the number of I/O pins and bonding strength, while simplifying the manufacturing process and reducing costs.
Implementation Method 1
applying heat while pressing the interposer and the substrate against each other to form a non-conductive layer
Implementation Method 2
thermally pressing the interposer and the substrate to form a non-conductive layer between the substrate and the interposer
Implementation Method 3
the connecting member includes a pillar in contact with the substrate, and a solder disposed on the pillar
Implementation Method 4
applying heat while pressing the interposer and the substrate against each other to form a non-conductive layer
Data Source
AI summary
Embodiments of inventive concepts disclosed provide a method of manufacturing a semiconductor package. The method includes mounting a plurality of semiconductor chips on a substrate having a connecting member protruding from a top surface of the substrate, applying a non-conductive paste on the substrate and the semiconductor chips, forming a supporting layer coupling each of the semiconductor chips to the substrate, aligning an interposer on the non-conductive paste, forming a non-conductive layer by applying heat while pressing the interposer and the substrate against each other, and cutting the substrate, the non-conductive layer, and the interposer into separate unit packages, each of which include a semiconductor chip.