3D Semiconductor Package Structure with Interposer Substrate
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Solution Overview
Problem
Existing packaging techniques for semiconductor devices are inadequate in providing optimal protection and connection while maintaining a compact size, leading to inefficiencies in production and performance.
Innovation Solution
A 3D packaging method involving a package substrate with laminated insulating layers and conductive features, an interposer substrate with redistribution layers, and conductive structures for bonding semiconductor devices, along with an underfill element for thermal conduction and protection, to enhance electrical performance and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If existing packaging techniques are used, then manufacturing simplicity is maintained, but signal transmission speed and electrical performance are insufficient
Solution Approach 1:
The patent transitions from traditional 2D packaging to 3D packaging by stacking multiple semiconductor devices and interposer substrates vertically. This dimensional change reduces signal transmission distance and enables higher-speed communication while managing complexity through standardized vertical stacking procedures.
Solution Approach 2:
The interposer substrate serves as an intermediary component between the package substrate and semiconductor devices. It provides redistribution layers that route signals efficiently, reduces RC delay, and enables direct mounting of passive elements, thereby improving electrical performance without requiring complete redesign of the entire packaging system.
2Area of stationary object
If package size is reduced, then area occupancy decreases, but heat dissipation becomes more difficult
Solution Approach 1:
By stacking devices vertically in the third dimension, the patent reduces the horizontal footprint of the package while maintaining adequate thermal management pathways. The vertical arrangement allows heat to be conducted through the stack to heat sinks or cooling structures, preventing thermal accumulation in compact configurations.
Solution Approach 2:
The interposer substrate acts as a thermal intermediary with embedded heat dissipation structures. It provides thermal conduction pathways that efficiently transfer heat from densely packed semiconductor devices to external cooling mechanisms, enabling compact packaging without compromising thermal performance.
3Speed
If RC delay is reduced through closer routing, then signal transmission improves, but signal noise and interference increase
Solution Approach 1:
The patent implements local quality optimization by providing shielding layers and ground references in proximity to signal traces on the interposer substrate. This localized approach to noise management allows aggressive routing for speed while maintaining signal integrity through targeted electromagnetic interference mitigation structures at critical locations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves signal transmission speed, reduces RC delay and signal noise, facilitates heat dissipation, and increases the reliability and performance of the package structure by allowing direct mounting of passive elements on the interposer substrate, resulting in a more efficient and reliable semiconductor package.
Implementation Method 1
an underfill element for thermal conduction and protection
Data Source
AI summary
A package structure and a method of forming the same are provided. The package structure includes a package substrate and an interposer substrate over the package substrate. The interposer substrate has a first surface facing the package substrate and a second surface opposite the first surface. A first semiconductor device is disposed on the first surface, and a second semiconductor device is disposed on the second surface. Conductive structures are disposed between the interposer substrate and the package substrate. The first semiconductor device is located between the conductive structures. A first side of the first semiconductor device is at a first distance from the most adjacent conductive structure, and a second side of the first semiconductor device is at a second distance from the most adjacent conductive structure. The first side is opposite the second side, and the first distance is greater than the second distance.