Semiconductor Package Isolation Layer for Heat Dissipation Protection
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Solution Overview
Problem
Semiconductor packages face challenges in thermal dissipation due to the poor thermal conductivity of typical molding materials used, which can lead to heat-related performance issues without compromising electrical insulation.
Innovation Solution
Incorporating an advanced isolation structure with higher thermal conductivity than the encapsulant material, thermally coupled to the semiconductor die, and applying a releasable layer to protect the isolation structure from damage during handling and assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If typical molding materials are used to form the package encapsulant body, then electrical insulation properties are excellent, but thermal dissipation capability is poor
Solution Approach 1:
The patent employs a composite structure consisting of a molding material encapsulant body combined with an isolation structure made of thermally conductive electrically insulating material. This composite approach allows the package to simultaneously achieve excellent electrical insulation from the molding material and improved thermal dissipation through the isolation structure that is thermally coupled to the semiconductor die.
2Temperature
If an isolation structure with higher thermal conductivity is introduced to improve heat dissipation, then thermal dissipation capability is enhanced, but the isolation structure becomes susceptible to damage during handling
Solution Approach 1:
The patent applies a releasable protective layer over the isolation structure before the package is subjected to handling and assembly operations. This protective layer acts as a cushioning measure taken in advance to prevent damage to the thermally conductive electrically insulating material during transport and assembly, while being removable before final mounting.
Solution Approach 2:
The releasable protective layer serves as an intermediary element between the isolation structure and the external environment during handling. This intermediate protective layer shields the vulnerable thermally conductive electrically insulating material from mechanical damage while allowing access to the isolation structure when needed for thermal contact.
3Reliability
If a protective layer is applied to protect the isolation structure, then structural integrity is maintained, but the device complexity increases
Solution Approach 1:
The patent employs a releasable protective layer that is designed as a temporary, disposable protective element. This protective layer is applied to protect the isolation structure during handling and transport, then removed before final assembly and mounting. The use of a temporary protective element rather than a permanent structural component minimizes the increase in device complexity while effectively protecting the isolation structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances thermal dissipation capabilities while maintaining electrical insulation, protecting the isolation structure from damage and allowing easy removal before mounting.
Implementation Method 1
the isolation structure has a greater thermal conductivity than the encapsulant portion, and wherein the isolation structure is thermally coupled to the semiconductor die
Implementation Method 2
the releasable layer is affixed to the semiconductor package, wherein a first outer face of the package body comprises a first surface of the isolation structure, and wherein the releasable layer at least partially covers the first surface of the isolation structure
Data Source
AI summary
A semiconductor device includes a semiconductor package, including a package body that includes an encapsulant portion and an isolation structure, a semiconductor die embedded within the package body, and a plurality of leads that protrude out from the encapsulant body, wherein the encapsulant portion and the isolation structure are each electrically insulating structures, wherein the isolation structure has a greater thermal conductivity than the encapsulant portion, and wherein the isolation structure is thermally coupled to the semiconductor die, and a releasable layer affixed to the semiconductor package, wherein a first outer face of the package body includes a first surface of the isolation structure, wherein the releasable layer at least partially covers the first surface of the isolation structure, and wherein the releasable layer is releasable from the semiconductor package.