Semiconductor Package Heat Sink Joint Structure for Leakage Control
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Solution Overview
Problem
Existing semiconductor packages face challenges in preventing the leakage of joining agents, such as filler metal or adhesive, during the joining process, which can lead to unfavorable incidents, especially near areas where semiconductors are mounted or connected to motherboards.
Innovation Solution
The semiconductor package design includes a substrate body with a frame shape and a through hole, and a heat-dissipating member with a top face serving as an element-mounting surface positioned in the through hole. The back face of the substrate body and the front face of the heat-dissipating member are joined with a joining agent, which is placed in a space enclosed by the back face, first riser portion, front face, and second riser portion, allowing the joining agent to spread within this space and reducing leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a joining agent is used to join the substrate body and heat-dissipating member, then the joining strength is improved, but the joining agent may leak to the front or back face of the semiconductor package
Solution Approach 1:
The substrate body is divided into multiple functional regions: a flat joining surface for bonding and riser portions that act as containment barriers. This segmentation allows the joining agent to be confined to specific areas while maintaining effective joining, preventing leakage to the front or back faces of the package.
Solution Approach 2:
The riser portions serve as intermediary structures between the joining surfaces and the external faces of the package. These raised barriers act as intermediaries that intercept and contain the joining agent, preventing it from reaching the front or back faces while still allowing the joining function to occur.
2Strength
If the substrate body and heat-dissipating member are joined with a joining agent, then the structural integrity is improved, but the positioning accuracy between components may deteriorate
Solution Approach 1:
The riser portions are pre-formed on the substrate body before the joining process. These pre-formed structures serve as positioning guides that constrain the heat-dissipating member to the correct position during assembly, ensuring accurate positioning before the joining agent is applied and cured.
Solution Approach 2:
The substrate body has different surface characteristics in different regions: flat areas for joining and raised riser portions for positioning and containment. This local differentiation of surface geometry provides both precise positioning functionality and effective joining surfaces in the same component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively reduces the probability of joining agent leakage to the front or back face of the semiconductor package, while also enhancing the accuracy of positioning between the substrate body and the heat-dissipating member, thereby minimizing the risk of stress-induced damage due to thermal expansion.
Implementation Method 1
the joining agent is melted in the joining process and spreads over the joining surfaces
Implementation Method 2
when the substrate body and the heat-dissipating member undergo thermal expansion in the joining process
Data Source
AI summary
A semiconductor package includes a substrate body made of an insulating material and having a frame shape with a through hole; and a heat-dissipating member made of a metallic material and having a top face serving as an element-mounting surface, the element-mounting surface being positioned in the through hole. A back face of the substrate body and a front face of the heat-dissipating member are joined to each other with a joining agent, the back face being oriented downward, the front face being oriented upward. The substrate body includes a first riser portion extending downward from the back face. The heat-dissipating member includes a second riser portion extending upward from the front face. The joining agent is placed in a space enclosed by the back face, the first riser portion, the front face, and the second riser portion.