Semiconductor Package Insulation Layer for High-Contrast Laser Marking
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Solution Overview
Problem
Semiconductor packages require a laser marking pattern for product information that is easily recognizable, but existing methods struggle to achieve sufficient contrast and visibility for effective recognition.
Innovation Solution
A semiconductor package design featuring an insulation layer with recessed portions and voids formed by dye particles absorbing laser energy, creating a visible pattern that can be recognized by optical inspection devices, using a photo-sensitive dye with strong absorption at 532 nm for enhanced contrast and visibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional laser marking methods are used on semiconductor packages, then product information can be marked, but the recognition feasibility and visibility of the marking pattern are insufficient
Solution Approach 1:
The patent applies color change principle by introducing a dye layer that absorbs laser energy and transforms it into visible color patterns. The dye layer changes from a uniform state to a patterned state with distinct colors (absorbed regions appear darker) that can be easily recognized by optical inspection devices, thereby solving the visibility and contrast problem of conventional laser marking methods.
Solution Approach 2:
The patent introduces a dye layer as an intermediary substance between the laser beam and the semiconductor package substrate. This dye layer mediates the laser marking process by absorbing laser energy and converting it into visible patterns, enabling effective recognition while protecting the underlying substrate from direct laser exposure.
2Loss of information
If laser energy is increased to improve marking visibility, then pattern contrast improves, but damage to the package material may occur
Solution Approach 1:
The dye layer serves as a protective intermediary that absorbs laser energy preferentially, shielding the underlying package materials from direct laser exposure. This allows sufficient laser energy to be applied for high-contrast marking without causing thermal damage to the semiconductor package substrate, as the dye layer acts as a sacrificial energy absorber.
Solution Approach 2:
The patent changes the optical parameters of the package surface by introducing a dye layer with specific absorption characteristics. This allows the use of laser wavelengths that are strongly absorbed by the dye but do not damage the underlying materials, effectively decoupling the marking contrast from the damage threshold through parameter optimization.
3Measurement precision
If a dye layer is added to enhance laser marking recognition, then marking visibility improves, but device complexity increases
Solution Approach 1:
The dye layer performs multiple functions simultaneously: it enhances laser marking visibility, protects the underlying substrate from laser damage, and provides a uniform base for pattern formation. By consolidating these functions into a single layer, the patent avoids the complexity that would arise from adding separate components for each function.
Solution Approach 2:
The dye layer is formed as a porous or distributed particulate layer that can be integrated into existing package structures without requiring complete redesign. This porous structure allows the dye to be applied as a coating or infused layer, minimizing structural complexity while achieving the desired optical effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enables clear recognition of the laser marking pattern, allowing the semiconductor package to pass visual and data code inspections, while minimizing impact on lithography processes.
Implementation Method 1
dye particles absorbing laser energy
Implementation Method 2
dye particles absorbing laser energy, creating a visible pattern
Data Source
AI summary
A semiconductor package includes a semiconductor component, a package body, a first RDL structure and an insulation layer. The package body surrounds the semiconductor component and has a first package surface. The first RDL structure is formed on the first package surface of the package body. The insulation layer is formed on the first RDL structure and includes an insulation body, a plurality of recessed portions and a plurality of voids, wherein the insulation body has a first insulation surface, the recessed portions are recessed with respect to the first insulation surface and form a pattern, and the voids are embedded in the insulation body.