Semiconductor Package Singulation With Laser-Ablated Tape Edges

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Solution Overview

Problem

The singulation process of semiconductor packages often results in tape burrs due to imperfect separation of the base film, which can hinder the attachment of metal shields and degrade the electromagnetic shielding performance of the packages.

Innovation Solution

A method involving the use of a laser beam to remove the base film at predetermined ablation regions before singulation, ensuring clean cutting edges and preventing tape burrs, followed by applying a conductive shield on the second side of the semiconductor packages using techniques like sputtering or PVD with materials such as silver or copper.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a metal shield is formed after the singulation process, then electromagnetic shielding performance is improved, but defects such as abnormal shields or metal burrs occur, thereby lowering electromagnetic shielding performance

Engineering Contradiction:

Improveelectromagnetic shielding performanceVSAvoidmetal shield quality

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by removing the base film at predetermined ablation regions before the singulation process. This pre-removal prevents tape burrs from forming during cutting, ensuring clean edges that allow metal shields to be formed without defects. The base film is selectively removed in advance at locations where cutting will occur, so that when singulation happens, no burrs are generated to interfere with subsequent metal shield formation.

Inventive Principle:

Principle #10Preliminary action

2Object-affected harmful factors

If the base film is not removed before singulation, then the adhesive tape remains intact for protection, but tape burrs are generated during cutting that hinder metal shield attachment

Engineering Contradiction:

Improvetape burrsVSAvoidbase film removal process

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The patent applies local quality by selectively removing the base film only at predetermined ablation regions corresponding to future cutting locations, rather than removing the entire base film. This localized removal maintains the protective function of the adhesive tape in non-cutting areas while eliminating tape burrs only where cutting will occur. The base film is preserved in regions where it provides protection but removed only where it would create harmful burrs.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The patent replaces mechanical removal methods with laser beam ablation to remove the base film. This substitution provides more precise control over the removal process, enabling selective elimination of the base film at predetermined regions without generating mechanical debris or affecting adjacent areas. The laser method achieves cleaner removal compared to mechanical scraping or cutting approaches.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enhances the electromagnetic shielding performance by eliminating tape burrs and ensuring a uniform, continuous metal shield on the semiconductor packages, thereby improving their shielding capabilities.

Implementation Method 1

removing, by a laser beam, the base film of the adhesive tape at a predetermined ablation region

Methodology Applied

Scientific EffectLaser ablation: Laser Ablation

Implementation Method 2

applying a conductive shield at a second side of each of the plurality of semiconductor packages, wherein the conductive shield is applied by any of the following: sputtering, spraying, electroplating, printing, painting, laminating, and physical vapor deposition (PVD)

Methodology Applied

Scientific EffectPhysical vapor deposition: Physical Vapour Deposition

Implementation Method 3

Methodology Applied

Scientific EffectSputtering: Sputtering

Data Source

PatentUS20230268315A1Method for making semiconductor packages

Publication Date: 2023.08.24 STATS CHIPPAC LTD

AI summary

The present application relates to a method for making semiconductor packages. The method for making semiconductor packages comprises forming a semiconductor package array, the semiconductor package array having at its first side a interconnect encasing layer; attaching an adhesive tape onto the interconnect encasing layer, wherein the adhesive layer has an adhesive layer and a base film; removing, by a laser beam, the base film of the adhesive tape at a predetermined ablation region; and singulating the semiconductor package array along the predetermined ablation regions to separate the semiconductor package array into a plurality of semiconductor packages.