Semiconductor Package Laser-Engraved Stoppers for Uniform Heat Transfer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages face issues with delamination and reduced heat transfer efficiency due to uneven adhesive thickness and metal layer cracking caused by grinding, leading to increased costs and insulation voltage problems.
Innovation Solution
A semiconductor package with a package housing featuring laser-engraved stoppers that adjust and maintain uniform heat transfer connector thickness, preventing delamination and enhancing heat transfer efficiency by ensuring consistent adhesive thickness and minimizing metal particle generation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a grinding wheel is used to remove the over-molded sealing member, then the sealing member can be removed, but the metal layer is cut and the insulating layer may crack
Solution Approach 1:
The patent replaces the mechanical grinding wheel system with a laser-based system. The laser beam selectively removes the sealing member through ablation without mechanical contact, preventing cuts to the metal layer and cracks in the insulating layer while achieving the same sealing member removal objective.
2Reliability
If the thickness of the metal layer is increased to prevent cracks, then crack prevention is improved, but manufacturing costs increase
Solution Approach 1:
By replacing mechanical grinding with laser processing, the patent eliminates the need to increase metal layer thickness for crack prevention. The laser's non-contact operation allows thin metal layers to be processed without mechanical stress, maintaining reliability while reducing material quantity and cost.
3Ease of manufacture
If adhesive is coated to bond the heat sink, then heat sink bonding is achieved, but the adhesive thickness becomes uneven and heat transfer efficiency is lowered
Solution Approach 1:
The patent performs preliminary action by creating precise reference surfaces and positioning structures on the substrate before adhesive coating. These pre-formed features guide the adhesive application process, ensuring uniform thickness and proper positioning, which directly improves heat transfer efficiency while maintaining ease of manufacture.
4Ease of manufacture
If a grinding wheel is used to remove the sealing member, then the sealing member can be removed, but metal particles remain and insulation voltage problems occur
Solution Approach 1:
The patent substitutes mechanical grinding with laser ablation, which vaporizes or ejects material without generating metal particles. This eliminates contamination of the sealing member removal zone with metal particles, preventing insulation voltage problems while maintaining effective sealing member removal.
5Ease of manufacture
If the adhesive thickness varies at both ends, then bonding is achieved, but delamination is generated due to stress
Solution Approach 1:
The patent implements preliminary action by forming precise reference surfaces and positioning structures before adhesive application. These pre-formed features ensure uniform adhesive distribution and thickness, eliminating stress concentrations that cause delamination while maintaining ease of bonding operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses delamination, maintains uniform heat transfer, and reduces costs by minimizing sealing member consumption and preventing ceramic cracks, while improving adhesive strength and thermal conductivity.
Implementation Method 1
a stopper which is engraved using a laser
Implementation Method 2
at least one heat sink transmitting heat from the semiconductor chips and radiating heat
Implementation Method 3
at least one heat sink transmitting heat from the semiconductor chips and radiating heat
Implementation Method 4
heat transfer connectors interposed therebetween
Data Source
AI summary
Provided is a semiconductor package having a package housing in an engraved surface form and a method of manufacturing the same, wherein the semiconductor package includes: at least one substrate on which at least one semiconductor chip is installed; at least one terminal lead electrically connected to the substrates; electrical connectors for connecting the semiconductor chips to the substrates or the terminal leads; a package housing covering the semiconductor chips, the electrical connectors, and the at least one substrate; at least one stopper which is formed of a material same as that of the package housing, is higher by a certain height than exposed surfaces of the substrates, is disposed on the exposed surfaces of the substrates, or covers at least a part of the exposed surfaces; and at least one heat sink transmitting heat from the semiconductor chips and radiating heat, wherein the at least a part of the exposed surfaces of the at least one substrate is formed on the upper surface, the lower surface, or the upper and lower surfaces of the package housing and the exposed surfaces of the at least one substrate are joined to the heat sinks by using heat transfer connectors interposed therebetween. Accordingly, the full thickness of the heat transfer connectors may be uniformly maintained.