Semiconductor Package Layout for Precise Terminal Laser Welding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor devices face challenges in maintaining positional accuracy of control terminals due to instability during heating tests, leading to improper connections and increased noise-induced malfunction.
Innovation Solution
A semiconductor device design featuring a second substrate with exposed conductive plates through openings in a case, allowing for post-connection of terminals, which reduces noise-induced malfunctions and improves positional accuracy by facilitating laser welding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If terminals are connected before heating tests, then connection stability is improved, but positional accuracy deteriorates due to thermal expansion and instability
Solution Approach 1:
The conductive plates are exposed through openings in the case before final terminal connection, allowing positioning and preparation to be completed in advance. This preliminary exposure enables the conductive plates to be positioned with high accuracy on the second substrate before the actual terminal welding occurs, thereby maintaining manufacturing precision while ensuring connection stability.
Solution Approach 2:
The connection process is divided into two stages: first, the conductive plates are exposed and positioned with high precision; second, terminals are connected to the exposed conductive plates. This segmentation allows each stage to be optimized independently - positioning accuracy in the first stage and connection reliability in the second stage.
2Device complexity
If conventional connection methods are used, then device complexity is reduced, but noise-induced malfunctions increase due to higher gate inductance
Solution Approach 1:
The patent replaces conventional mechanical terminal connections with laser welding technology. Laser welding provides lower gate inductance compared to traditional mechanical connections, thereby reducing noise-induced malfunctions while maintaining relatively simple device structure. The laser welding process directly joins terminals to conductive plates through the exposed openings, achieving both simplicity and performance.
3Reliability
If conductive plates are fully enclosed, then protection is improved, but accessibility for terminal connection deteriorates
Solution Approach 1:
The case is segmented with specific openings at strategic locations to expose the conductive plates. This segmentation approach provides both protection (the case remains largely enclosed) and accessibility (openings allow terminal connection). The openings are positioned to expose only the necessary conductive plate areas while maintaining overall structural protection.
Solution Approach 2:
The case structure transitions from fully enclosed to locally open at specific positions where conductive plates need to be accessed. This local quality change provides targeted accessibility for terminal connection while maintaining protection for the rest of the internal components. The openings are precisely located to expose conductive plates for connection while preserving overall case protection functionality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances terminal positional accuracy and reduces gate inductance, preventing noise-induced malfunctions while ensuring stable connections.
Implementation Method 1
a terminal and an electronic component are connected to the exposed conductor portion
Data Source
AI summary
A semiconductor device, including: a semiconductor chip having a plurality of main electrodes and a gate electrode; a first substrate on which the semiconductor chip is mounted; a second substrate located above the first substrate, the second substrate having a conductive plate on a front surface thereof, the conductive plate being electrically connected to the semiconductor chip; and a case having an opening in an upper surface thereof, at least a part of the conductive plate being exposed through the opening, the case incorporating the semiconductor chip, the first substrate, and the second substrate.