Semiconductor Package with 3D Lead Frame and Liquid-Cooled Heat Sinks
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional power modules face challenges with high package volume, weight, and cost due to wire-bonded interconnections, and lack effective thermal management, which can lead to safety issues and inefficiencies in power dissipation, especially with wide band gap devices.
Innovation Solution
A semiconductor package design utilizing 3D copper lead frames or flexible printed circuits for lateral and vertical interconnections, integrated with liquid-cooled heat sinks and embedded sensors for real-time monitoring, enabling efficient thermal management and reduced form factor, weight, and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional wire-bond interconnection scheme is used, then electrical interconnection is achieved, but package volume increases due to height of bond wires
Solution Approach 1:
The patent transitions from planar (2D) wire-bond interconnection to three-dimensional (3D) lead frame interconnection. The lead frame extends vertically and laterally to provide multiple interconnection paths, effectively utilizing the Z-dimension to reduce the need for tall bond wires while maintaining electrical connectivity. This dimensional change allows for more compact package design.
Solution Approach 2:
The lead frame is segmented into multiple independent leads that can be independently configured to connect different electrical components. This segmentation allows for optimized routing of electrical connections without requiring a single tall bond wire structure, thereby reducing overall package volume while maintaining manufacturing ease.
2Ease of manufacture
If double-sided direct bonded coppers (DBCs) are used for planar interconnection, then electrical interconnection is achieved, but package weight increases due to thick and heavy DBC substrates
Solution Approach 1:
The patent employs thin copper foil layers on the lead frame instead of thick DBC substrates. These thin copper films provide the necessary electrical interconnection while significantly reducing the weight compared to conventional thick DBC substrates. The lead frame structure supports these thin films without requiring the heavy substrate material.
Solution Approach 2:
The lead frame serves multiple functions simultaneously: it provides mechanical support, electrical interconnection, and thermal management pathways. This multi-functionality eliminates the need for separate heavy DBC substrates that would otherwise be required for electrical interconnection, thereby reducing overall package weight.
3Strength
If conventional power module packaging is used, then mechanical support is provided, but thermal management becomes inadequate due to high power dissipation
Solution Approach 1:
The patent introduces thermal interface materials and thermal vias as intermediaries between the power semiconductor devices and the heat sink. These intermediaries facilitate efficient heat transfer from the devices through the lead frame to the heat sink, addressing thermal management challenges while maintaining the mechanical support structure.
Solution Approach 2:
The lead frame incorporates composite structures with high thermal conductivity materials to enhance heat dissipation capabilities. The combination of mechanical strength materials with thermally conductive materials creates a structure that simultaneously provides mechanical support and effective thermal management for high power dissipation applications.
4Reliability
If thick DBC substrates are used for interconnection, then electrical connectivity is improved, but manufacturing cost increases due to thick and costly substrates
Solution Approach 1:
The patent uses cost-effective thin copper foil layers instead of expensive thick DBC substrates. These thin copper films provide sufficient electrical connectivity for the application while significantly reducing material costs. The lead frame structure compensates for the reduced substrate thickness, maintaining reliability without requiring expensive substrates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution enhances thermal performance, reduces package size and weight, lowers costs, and improves reliability by providing efficient heat dissipation and accurate temperature sensing, outperforming conventional and state-of-the-art power modules.
Implementation Method 1
a first bonding layer bonding the first side of the first electrical component and a first portion of the first package interconnection component
Implementation Method 2
a first heat sink... a first interface layer bonding or adhering the first heat sink and the first package interconnection component
Implementation Method 3
liquid-cooled heat sinks
Data Source
AI summary
Various embodiments may provide a semiconductor package. The semiconductor package may include a first electrical component, a second electrical component, a first heat sink, and a second heat sink bonded to a first package interconnection component and a second package interconnection component. The first package interconnection component and the second package interconnection component may provide lateral and vertical interconnections in the package.