Semiconductor Package with Lead Frame Opening for High Density
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Solution Overview
Problem
Conventional semiconductor packages face challenges in efficiently integrating multiple dies on a single lead frame, particularly in maintaining consistent and reliable inter-die connections without being affected by surrounding components, which can impact circuit performance.
Innovation Solution
A semiconductor package design where a first semiconductor die is coupled to the backside of a second semiconductor die using an adhesive and mechanically and electrically connected to a lead frame through wire bonds, with the first die positioned within an opening in the lead frame, allowing for increased density and thermal relief, and encapsulated with a mold compound for protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple die are stacked and connected on a single lead frame using conventional wire bonding, then die capacity is increased, but inter-die connections are affected by surrounding components leading to inconsistent circuit performance
Solution Approach 1:
The lead frame is segmented by creating an opening that physically separates the first die from surrounding components. This segmentation isolates the inter-die connections within the opening, preventing interference from adjacent components and ensuring consistent circuit performance while maintaining high die capacity.
Solution Approach 2:
The opening in the lead frame acts as an intermediary structure that facilitates reliable inter-die connections. By providing a dedicated space that isolates the connection path, the opening mediates between the stacked die and surrounding components, ensuring signal integrity and connection consistency.
2Reliability
If die are connected through stacked connections, then inter-die connectivity is achieved, but surrounding components impact circuit performance
Solution Approach 1:
The opening segments the connection path by creating a physical boundary that separates inter-die connections from surrounding components. This segmentation eliminates harmful electromagnetic interference and signal crosstalk from adjacent components, ensuring reliable connectivity.
Solution Approach 2:
The opening extracts or removes the harmful influence of surrounding components from the inter-die connection path. By creating a clear space that excludes adjacent components, the design eliminates their interfering effects while maintaining necessary connectivity.
3Reliability
If first die is positioned within an opening in the lead frame, then thermal relief and connection consistency are improved, but manufacturing complexity increases
Solution Approach 1:
The opening is created in the lead frame during the molding process as a preliminary action. By pre-forming the opening structure before die attachment, the design simplifies subsequent assembly steps and maintains manufacturing efficiency while achieving improved connection consistency and thermal relief.
Solution Approach 2:
The opening creation is merged with the lead frame fabrication process itself. By integrating the opening formation into the existing manufacturing workflow rather than adding separate steps, the design achieves structural improvements without proportionally increasing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances circuit performance by minimizing the impact of surrounding components on inter-die connections, ensuring consistent and repeatable connections, and providing thermal benefits, while allowing for increased die capacity without additional space on a circuit board.
Implementation Method 1
The first semiconductor die may be coupled to a backside of the second semiconductor die by an adhesive on a second side of the first semiconductor die opposing the first side
Implementation Method 2
The second semiconductor die may be mechanically and electrically coupled to the lead frame through one or more wire bonds at the die attach area
Implementation Method 3
A majority of the lead frame, the second semiconductor die and the first semiconductor die may be encapsulated with a mold compound
Data Source
AI summary
Implementations of semiconductor packages may include: a first semiconductor die having a plurality of balls coupled to a first side thereof, a second semiconductor die, a lead frame having a die attach area on a first side of the lead frame, the die attach area containing an opening therethrough and one or more wire bonds. The first semiconductor die may be coupled to a backside of the second semiconductor die by an adhesive on a second side of the first semiconductor die opposing the first side. The second semiconductor die may be mechanically and electrically coupled to the lead frame through one or more wire bonds at the die attach area. The first semiconductor die may be positioned within the opening in the center of the lead frame.