Semiconductor Package Lead Frame Segmentation for Thermal Management
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Solution Overview
Problem
Current semiconductor device packages face challenges in simultaneously achieving high power handling, high speed/high frequency operations, and efficient heat dissipation, particularly for devices using Group III-V based materials like GaN, as they often compromise on either operating speed or heat dissipation characteristics.
Innovation Solution
The semiconductor device package design incorporates a supporting structure with a first lead frame acting as a heat dissipation element, a second lead frame electrically connected with an insulator in between, and a resin layer with high thermal conductivity, allowing for efficient heat dissipation and electrical connection, while using a flip-chip mounting method to reduce parasitic components and enhance throughput.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a semiconductor device package is designed for high power handling, then heat dissipation characteristic is improved, but operating speed deteriorates
Solution Approach 1:
The lead frame is divided into multiple independent lead frames (first lead frame and second lead frame) that are electrically isolated from each other by an insulator. This segmentation allows separate optimization of heat dissipation paths and signal paths, enabling high power handling through the first lead frame while maintaining high operating speed through the second lead frame.
Solution Approach 2:
An insulator is introduced as an intermediary element between the first lead frame and the second lead frame. This insulator electrically isolates the two lead frames while allowing them to be mechanically coupled, enabling independent optimization of each lead frame's function without electrical interference.
2Speed
If a semiconductor device package is designed for high speed operation, then parasitic inductance is reduced, but power handling capability deteriorates
Solution Approach 1:
The lead frame system is segmented into multiple independent lead frames, each optimized for specific functions. The second lead frame is designed with configurations that minimize parasitic inductance for high-speed signal transmission, while the first lead frame handles high power dissipation, thereby achieving both high speed operation and high power handling capability simultaneously.
3Power
If multiple lead frames are used for electrical connection, then power handling and heat dissipation are improved, but device complexity increases
Solution Approach 1:
Multiple lead frames are merged into a single integrated package structure through mechanical coupling with an insulator. The first and second lead frames are positioned and connected in a coordinated manner, allowing multiple functions (heat dissipation, electrical connection, signal transmission) to be achieved within a unified package structure, thereby reducing overall device complexity despite using multiple lead frames.
4Speed
If advanced packaging methods are used to reduce parasitic components, then operating speed is improved, but manufacturing difficulty increases
Solution Approach 1:
The insulator is pre-formed with predetermined positions and configurations for coupling multiple lead frames. This preliminary preparation of the insulator structure enables subsequent assembly steps to be simplified, as the lead frames can be directly positioned and connected without complex alignment procedures, thereby maintaining manufacturing ease while achieving reduced parasitic components through advanced packaging.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design achieves improved heat dissipation, reduced parasitic components, enhanced withstand voltage, and high power handling capabilities, making it suitable for high-speed and high-frequency operations, particularly for GaN-based devices, while being easily manufacturable and compact in size.
Implementation Method 1
an insulator configured to electrically insulate the first and second lead frames
Implementation Method 2
a first lead frame comprising a heat dissipation element
Data Source
AI summary
A semiconductor device package may include: a semiconductor chip element; and a supporting structure on which the semiconductor chip element is mounted and including an electrical connection element for connecting the semiconductor chip element to an external terminal. The supporting structure may include: a first lead frame including a heat dissipation element; a second lead frame coupled to the first lead frame; and/or an insulator configured to electrically insulate the first and second lead frames from each other. Each of the first and second lead frames may include a mounting region on which the semiconductor chip element is mounted. The first lead frame may include: a first portion; and/or a second portion formed on the first portion and having a smaller width than that of the first portion. The insulator may be on the first portion around the second portion. The second lead frame may be on the insulator.