Semiconductor Package Leadframe Layout for Low-Resistance Heat Dissipation
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Solution Overview
Problem
Existing semiconductor packages face challenges in thermal and electrical performance due to the integration of multiple semiconductor devices, particularly with the increasing power requirements of high-voltage devices like Group III nitride devices, which require improved internal rewiring structures to prevent overheating and support higher currents without reducing electrical performance.
Innovation Solution
The semiconductor package design includes a leadframe with die pads used solely for internal electrical redistribution, featuring larger cross-sectional connectors and a solder stop structure, allowing for reduced electrical resistance and improved thermal dissipation by using one die pad for multiple devices, maintaining a standard package outline.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple semiconductor devices are integrated in a single package, then circuit design is simplified and performance is improved, but thermal and electrical performance deteriorates due to heat generation and electrical resistance
Solution Approach 1:
The package is segmented into multiple die pads (first die pad, second die pad, third die pad) that are laterally spaced apart, allowing heat from different semiconductor devices to be dissipated through separate thermal pathways to the heat sink, preventing heat accumulation in a single location
Solution Approach 2:
The invention transitions from a single-plane mounting approach to a three-dimensional arrangement where die pads are distributed across multiple lateral positions and connected through vertical connectors, creating additional thermal pathways and reducing thermal interference between devices
2Adaptability or versatility
If multiple semiconductor devices are integrated in a single package, then circuit design is simplified, but electrical resistance increases due to internal rewiring requirements
Solution Approach 1:
The electrical connection path is segmented into multiple independent components: die pads, connectors, and heat sink connections. Each segment is optimized for its specific function, allowing the overall system to achieve low resistance despite the distributed architecture
Solution Approach 2:
Connectors serve as intermediary elements between the semiconductor devices mounted on different die pads and the heat sink, providing low-resistance electrical pathways that eliminate the need for complex internal rewiring while maintaining reliable electrical performance
3Reliability
If larger connectors are used to reduce electrical resistance, then electrical performance is improved, but device complexity increases
Solution Approach 1:
The connectors serve multiple functions simultaneously: they provide low-resistance electrical pathways between die pads and the heat sink, act as mechanical support structures, and facilitate thermal management. This multi-functionality reduces the need for additional specialized components, maintaining simplicity despite improved electrical performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal and electrical performance by reducing heat generation and maintaining a standard package footprint, facilitating integration into existing circuits without requiring modifications.
Implementation Method 1
The first power semiconductor device is electrically coupled to the second die pad by a bond wire
Implementation Method 2
The contact clip is connected to the second die pad by a solder connection
Implementation Method 3
the lower surface of the second die pad is spaced apart from a side face of the semiconductor package by a distance that is greater than the length of individual leads
Implementation Method 4
improved thermal dissipation
Data Source
AI summary
A semiconductor package includes: a leadframe having first, second and third die pads and leads, each die pad having upper and lower surfaces; first and second power semiconductor devices; a control semiconductor device; and a mold compound. The upper surface of each die pad is arranged within the mold compound. The lower surface of the second die pad is spaced apart from a side face of the semiconductor package by a distance that is greater than a length of the individual leads. The first power semiconductor device is mounted on the upper surface of the first die pad and electrically coupled to the second die pad by one or more first connectors extending between the first device and the upper surface of the second die pad. The upper surface of the second die pad is occupied by the one or more connectors or in direct contact with the mold compound.