Semiconductor Package Layout for Lens-Focused Optical Coupling
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Solution Overview
Problem
Copper data channels face signal attenuation and crosstalk due to radiated electromagnetic energy, while optical communication systems are expensive and complex.
Innovation Solution
A semiconductor package design incorporating a photonic die with an optical coupler, through vias, and an electronic die, bonded with a lens structure to focus light beams, reducing signal decay and divergence.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If optical communication systems are used to overcome copper channel limitations, then signal transmission quality is improved, but manufacturing cost and system complexity increase
Solution Approach 1:
The patent combines photonic die and electronic die into a single integrated semiconductor package, merging optical and electrical functions in one device. This integration reduces the number of separate components and interconnections needed, thereby reducing manufacturing complexity while maintaining optical transmission quality
Solution Approach 2:
The semiconductor package structure serves multiple functions simultaneously: it provides mechanical support, electrical connections through through-vias, optical transmission through the photonic die, and signal routing. This multi-functionality reduces the need for separate specialized components, simplifying the overall system while maintaining reliable optical communication
2Reliability
If lens structure is added to focus light beams, then optical coupling efficiency is improved, but device complexity increases
Solution Approach 1:
The lens structure is integrated directly into the photonic die, merging the optical focusing function with the existing photonic component. This integration approach adds the lens functionality without requiring a separate lens component or additional alignment mechanisms, thereby improving optical coupling efficiency while minimizing increases in device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances optical coupling efficiency by minimizing signal loss and complexity, offering a cost-effective alternative to traditional optical communication systems.
Implementation Method 1
The optical coupler is configured to be optically coupled to an optical signal source through the lens structure
Implementation Method 2
a lens structure disposed over the photonic die and overlapped with the optical coupler from a top view
Data Source
AI summary
A semiconductor package includes a photonic die, an encapsulated electronic die, a substrate, and a lens structure. The photonic die includes an optical coupler. The encapsulated electronic die is disposed over and bonded to the photonic die. The encapsulated electronic die includes an electronic die and an encapsulating material at least laterally encapsulating the electronic die. The substrate is disposed over and bonded to the encapsulated electronic die. The lens structure is disposed over the photonic die and is overlapped with the optical coupler from a top view. The optical coupler is configured to be optically coupled to an optical signal source through the lens structure.