Semiconductor Package Cavity Structure for Compact Lens Mounting
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Solution Overview
Problem
Existing semiconductor device packages are large in size, difficult to mount lenses, and not easily manufacturable for dense disposition.
Innovation Solution
A semiconductor device package design featuring a body with a first cavity having an inclined surface and multiple perpendicular surfaces, allowing for a compact size and easy lens mounting, with a substrate and light transmission member for efficient light control and distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a conventional semiconductor device package structure is used, then the device can be manufactured with standard processes, but the package size becomes large and lens mounting becomes difficult
Solution Approach 1:
The package body is segmented into multiple functional surfaces: a first inclined surface for light extraction, multiple second surfaces perpendicular to the substrate for lens mounting, and corner portions for structural support. This segmentation allows each surface to serve its specific function optimally, enabling compact packaging while facilitating easy lens attachment on the second surfaces.
Solution Approach 2:
The invention introduces vertical dimensionality by creating surfaces perpendicular to the substrate (second surfaces) in addition to the inclined light extraction surface. This multi-dimensional surface configuration allows lenses to be mounted vertically on the side surfaces while maintaining a compact horizontal footprint, thus reducing overall package size while enabling easy lens coupling.
2Productivity
If the package size is reduced for dense disposition, then manufacturing efficiency improves, but lens mounting becomes more difficult
Solution Approach 1:
Different regions of the package body are given different local qualities: the first inclined surface has light extraction properties, while the multiple second surfaces have lens-mounting properties with appropriate flat areas and perpendicular orientations. This local differentiation allows the package to maintain compact dimensions for high-density mounting while providing dedicated zones that are optimized for easy lens attachment operations.
3Illumination intensity
If conventional cavity structures are used, then manufacturing is straightforward, but light flux and uniformity are insufficient
Solution Approach 1:
The cavity structure employs asymmetric surface configurations: a first inclined surface at a specific angle for optimal light extraction, combined with multiple perpendicular second surfaces for lens mounting. This asymmetric design improves light flux and uniformity compared to conventional symmetric cavities, while the systematic arrangement of surfaces keeps the manufacturing process manageable through standardized fabrication steps.
Data Source
AI summary
An embodiment provides a semiconductor device package and a light emitting device comprising same, the semiconductor device package comprising: a body including a first cavity; and a semiconductor device disposed within the first cavity, wherein: the first cavity includes a first surface inclined such that the area of the cavity gradually increases as going away from the semiconductor device, and a plurality of second surfaces perpendicular to the upper surface of the semiconductor device; the body includes a first outer surface and a third outer surface that are opposite to each other, a second outer surface and a fourth surface that are opposite to each other, a first corner portion disposed in a region where the first and second outer surfaces meet each other, a second corner portion disposed in a region where the second and third outer surfaces meet each other, a third corner portion disposed in a region where the third and fourth outer surfaces meet each other, and a fourth corner portion disposed in a region where the fourth and first outer surfaces meet each other; and the plurality of second surfaces are disposed between the first and second corner portions, between the second and third corner portions, between the third and fourth corner portions, and between the fourth and first corner portions, respectively.